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MEMS Display / Optics

Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector

Product code
EUR 3 290
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Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.

The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640×480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.

The IR laser projector from STMicroelectronics integrates an infrared laser diode, low power class 1, and a resonant micro-mirror manufactured by STMicroelectronics. The projector is tiny, only 11.7mm x 8.4mm x 3.1mm and has a capability of 60fps.

STMicroelectronics has developed an intelligent design to reduce the dimension of the micro-mirror, facilitating its driving and dramacticly reducing the number of manufacturing steps in order to reduce the cost.

Based on a complete teardown analysis of the RealSense 3D Camera and the STMicroelectronics IR Laser Projector, the 2 reports provide the bill-of-material (BOM) and the manufacturing cost of the 3D Camera Module as well as a complete physical analysis and manufacturing cost estimation of the IR Laser Projector.

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Intel RealSense 3D Camera Module

Intel Company Profile


  • Physical Analysis Methodology
  • Module Teardown
  • Electronic Boards

Cost Analysis

  • Accessing the BOM
  • Estimation of the Cost of the PCBs
  • Estimation of the Intel Processor
  • Estimation of the cost of the Sensors
  • BOM Cost – Electronic Boards
  • Accessing the Added Value (AV) cost
  • Electronic Boards Manufacturing Flow
  • Details of the Module Assembly AV Cost
  • Manufacturing Cost Breakdown
  • Estimation of the Manufacturing Price – Intel

Resonant Micro-Mirror

STMicroelectronics Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • IR Laser Projector
    • Package Characteristics & Pin-out
    • Package Opening & Wire Bonding Process
    • Lens Line
    • Laser Diode
  • Resonant Micro-Mirror
    • View, Dimensions & Marking
    • Resonant Micro-Mirror
    • Comb
    • Thickness
    • Bonding
    • Cross-Section

Manufacturing Process Flow

  • Global Overview
  • MEMS Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • MEMS Front-End Cost
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost

Price Analysis

  • Selling Price Estimation
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