MEMS Display / Optics

Intel RealSense 3D Camera & STMicroelectronics IR Laser Projector

Published: 24/09/2015
Product code: SP15229
Price: EUR 3 290
Applications: Consumer

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Introduction
Summary
Similar reports

Intel RealSense is an intelligent 3D camera equipped with a system of three components: a conventional camera, a near infrared image sensor and an infrared laser projector. Infrared parts are used to calculate the distance between objects, but also to separate objects on different planes. They serve for facial recognition as well as gestures tracking.

The Intel 3D camera can scan the environment from 0.2m to 1.2m. The fixed-focal length camera will support up to 1080p @30FPS capture in RGB with a 77° FOV. Its lens has a built in IR cut filter. The 640×480 pixel VGA camera has a frame rate up to 60fps with a 90° FOV, moreover its lens has an IR Band Pass filter.

The IR laser projector from STMicroelectronics integrates an infrared laser diode, low power class 1, and a resonant micro-mirror manufactured by STMicroelectronics. The projector is tiny, only 11.7mm x 8.4mm x 3.1mm and has a capability of 60fps.

STMicroelectronics has developed an intelligent design to reduce the dimension of the micro-mirror, facilitating its driving and dramacticly reducing the number of manufacturing steps in order to reduce the cost.

Based on a complete teardown analysis of the RealSense 3D Camera and the STMicroelectronics IR Laser Projector, the 2 reports provide the bill-of-material (BOM) and the manufacturing cost of the 3D Camera Module as well as a complete physical analysis and manufacturing cost estimation of the IR Laser Projector.

Intel RealSense 3D Camera Module

Intel Company Profile

Teardown

Physical Analysis Methodology
Module Teardown
Electronic Boards

Cost Analysis

Accessing the BOM
Estimation of the Cost of the PCBs
Estimation of the Intel Processor
Estimation of the cost of the Sensors
BOM Cost – Electronic Boards
Accessing the Added Value (AV) cost
Electronic Boards Manufacturing Flow
Details of the Module Assembly AV Cost
Manufacturing Cost Breakdown
Estimation of the Manufacturing Price – Intel

Resonant Micro-Mirror

STMicroelectronics Company Profile

Physical Analysis

Physical Analysis Methodology
IR Laser Projector
- Package Characteristics & Pin-out
- Package Opening & Wire Bonding Process
- Lens Line
- Laser Diode

Resonant Micro-Mirror
- View, Dimensions & Marking
- Resonant Micro-Mirror
- Comb
- Thickness
- Bonding
- Cross-Section

Manufacturing Process Flow

Global Overview
MEMS Process Flow
Wafer Fabrication Units
Packaging Process Flow & Assembly Unit

Cost Analysis

MEMS Front-End Cost
MEMS Front-End Cost per process steps
MEMS Wafer & Die Cost
Back-End : Packaging Cost

Price Analysis

Selling Price Estimation