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PACKAGING SIP

Intel® Curie™ Module High Density System-in-Package for IoT, Ultra-small, low-power hardware module for wearables - System Plus Consulting

Intel® Curie™ Module – SiP

Published
27/07/2016
Product code
SP16277
Price
EUR 3 490
Applications
Consumer
Available sample Available flyer Ask for info

Intel®, whose microprocessors can be found in almost every computer worldwide, has commenced the 2016 “wearables race” by introducing the Intel® Curie™ module. This tiny system-in-package (SiP) can be found in the latest Arduino® Board: the Genuino 101 for the European version and the Arduino 101  for the US version. The module includes the Intel Quark chip, Bluetooth low-energy radio, sensors, and battery charging, all in a single package of less than 150mm3.

This complete, low-power solution comes with computing, motion sensing, Bluetooth low energy, battery charging, and pattern matching capabilities for optimal sensor data analysis, enabling quick and easy identification of actions and motions. The module is packaged in a tiny form factor and runs a new software platform created especially for the Intel Curie module.

Located on the main board, the system uses non-conventional packaging developed by Intel. The main microcontroller is located at the bottom of the package, with features like Bluetooth and sensors placed on top.

Powered by the Intel Quark™ SE SoC embedded in the 10-layer build-up coreless PCB, the Intel Curie module is extremely power-efficient – ideal for “always-on” applications like health and wellness, sports activities, etc. Its other features are insured by 13 active dies, plus passives components embedded in the 11x8mm package’s top molding. By integrating several dies and offering several functions, Intel® has realized the smallest low-power complete solution.

This report includes a complete analysis of the SiP, featuring die observation, package cross-section, and a function explanation, analyzing all data related to the module’s cost efficiency.

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Overview/Introduction

Company Profile & Supply Chain

Physical Analysis

  • Physical Analysis Methodology
  • Genuino 101 Teardown (European)
    • Intel Curie removal
  • Curie SiP Packaging Analysis
    • Package view and dimensions
    • Package x-ray view
    • Package opening
    • Package cross-section
  • Top Packaging Analysis
    • Dies and MEMS sensor view, dimensions, and marking
    • Dies and MEMS sensor summary
    • Dies and MEMS sensor cross-section
  • Quark Microcontroller Analysis
    • Die view and dimensions
    • Die cross-section
    • Die process

Manufacturing Process Flow

  • Chip Fabrication Unit
  • Packaging Fabrication Unit
  • SiP Package Process Flow

Cost Analysis

  • Synthesis of the Cost Analysis
  • Supply Chain Description
  • Yield Hypotheses
  • SiP Package Cost Analysis
    • SiP packaging cost
    • SiP cost per process step
  • Final Test Cost
  • Component Cost

Estimated Price Analysis

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