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Integrated Passive Devices Comparison 2021 - Die Topsides - Optical View - System Plus Consulting

Integrated Passive Devices Comparison 2021

Published
14/10/2021
Product code
SPR21535
Price
EUR 6,490
Applications
Industrial Mobile & Consumer Telecom & Infrastructure
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A technical and cost analysis of 8 IPDs and 12 silicon capacitors from 11 different manufacturers including STMicroelectronics, Skyworks, Murata, and more.

Integrated Passive Devices Comparison 2021 - Die Topsides - Optical View - System Plus Consulting

Passive devices (inductor, capacitor, and resistor) are essential building blocks in electronics. The integrated passive device (IPD) is a specialty technology considered as an evolution of standard passives. According to Yole Développement, IPD will reach a total market of almost $607M in 2025, exhibiting a CAGR of 6.5% from 2019-2025.

In this report, System Plus Consulting presents a technological and cost overview of eight IPDs occupying different ranges of communication frequency, as well as 12 Si capacitors targeting multiple applications.

The eight IPD devices studied in this report are in three categories: Balun for 2.4 GHz Wifi, filter for n77/n78/79 5G bands, and multipurpose filter/ESD. These devices are found in different consumer products such as smartphones, notebooks, and smartwatches. They are manufactured by several players: NXP, Qualcomm, STMicroelectronics, UMC, Qorvo, and Skyworks.

The 12 Si capacitors are divided into seven devices with Deep Trench Technology from Murata and TSMC. Si capacitors from TSMC are land-side decoupling capacitors found in A14 and M1 application processors from Apple. The other five devices are multipurpose planar capacitors from Microchip, Macom, Skyworks, and Vishay.

This report includes a description of each component and its major characteristics (substrate type (silicon, glass)), passivation layers, and passive integration, along with a comparison of all devices analyzed. Also provided are detailed optical and SEM pictures from the device’s opened-package, down to the microscopic level. The focus of this report is on chip technology, hence the devices are analyzed and costs are simulated at wafer and die levels.

Lastly, this report provides physical, technological, and manufacturing cost comparisons of the analyzed devices.

Integrated Passive Devices Comparison 2021 - Die Topsides - Optical View - System Plus Consulting Integrated Passive Devices Comparison 2021 - Die Topsides - Optical View - System Plus Consulting Integrated Passive Devices Comparison 2021 - Die Cross-Section – SEM View - System Plus Consulting
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Overview / Introduction

Technology and Market

Company Profile

Physical Analysis

  • IPD Analysis
    • NXP ESD Filter Die Analysis
      • Die Views and Dimensions
      • Die Cross-Section
      • Die Process Characteristics
    • Qualcomm n77/n78/79 Filter Die Analysis
    • NXP ESD Filter Die Analysis
    • STMicroelectronics ESD Filter Die Analysis
    • STMicroelectronics 2.4 GHz Wi-Fi Balun Die Analysis
    • Mediatek Wi-Fi/BT Balun Die Analysis
    • Qorvo B46 Diplexer/Coupler Die Analysis
    • Atheros Wi-Fi Dual Band Balun Die Analysis
    • SiGe Wi-Fi Dual Band Balun Die Analysis
  • Silicon Capacitor Analysis
      • Deep Trench Capacitors
        • Murata
          • Die Views and Dimensions
          • Die Delayering
          • Die Cross-Section
        • TSMC
      • Planar Capacitor
          • Die Views and Dimensions
          • Die Cross-Section
        • Microchip
        • Macom
        • Skyworks
        • Vishay

Technology and Physical Comparison

  • IPDs
  • Si Capacitors

Manufacturing Process Flow

  • IPDs – Wafer Fabrication Unit and Process
  • Silicon Capacitors – Wafer Fabrication Unit and Process
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