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Inertial MEMS Manufacturing Trends 2014 – Volumes 1 & 2

Published
17/03/2014
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EUR 6990
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System Plus Consulting & Yole Développement have joined their expertise to publish a complete analysis on Inertial MEMS  Manufacturing Trends 2014.

  • More than 46 new MEMScomponents analyzed, including 10+ combos
  • Deep analysis of disruptive approaches, including M&NEMS and BAW-based gyroscopes
  • Evolutionary analysis of inertial MEMS devices from 2007 to 2013, including die size, manufacturing cost, component performance and more
  • Detailed front-end process flow for a typical MEMS accelerometer and MEMS gyroscope
  • Device’s structure and manufacturing cost are analyzed

OBJECTIVES OF THE REPORT

Over the last years, inertial MEMS have been subject to dramatic market & technological evolution. This has been driven by a large increase of the consumer market. Along with “stand-alone” MEMS devices,
inertial combo sensors – a combination of several inertial sensors in a single package – are also coming.
Main applications are consumer – e.g. accelerometer with magnetometer or accelerometer with gyro – and automotive for ESC and rollover functions first.
To give clues about the differences in cost, size, package, structures … of the different inertial MEMS, System plus Consulting and Yole Développement have released this report in order to:

  • Provide an understanding of the market drivers for inertial MEMS
  • Give trends about packaging and test strategies
  • Provide in-depth analysis for 23 MEMS devices in terms of cost, size, package type, performance
  • Have a comparative analysis in terms of performance, cost, MEMS size, ASIC cost, ASIC size, package size, year for market introduction.

A second report “Front-End, Assembly & Test Trends for Inertial MEMS & Magnetometers – REVERSE
ENGINEERING/COSTING” depicts photos for each device: Package view / MEMS & ASIC dimensions /
close-up MEMS structure / specific process steps / cost breakdown

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Volume 1 – Analysis

Introduction 12

• Executive summary 14

Inertial MEMS markets 46

> Market forecast in $M, in units, in wafers

> Market drivers

> Technical solutions to answer the market drivers

• Detection principles for inertial MEMS,and new developments 105

> Accelerometers

> Gyroscopes

> Magnetometers

> Combos

• Packaging trends 191

• Comparative analysis of inertial sensors’different inertial generations 217

• Conclusion 261

Volume 2 – Reverse engineering

• Reverse Costing Methodology 6

2014 components under analysis (23) 8

> Accelerometers 36

– Analog Devices ADXL362 / ST LIS302DL with TSV / mCube 3-axis accelerometer

> Gyroscopes 55

– Bosch Sensortec BMG160 / STMicroelectronics L3G3250 / STMicroelectronics L3GD20H /STMicroelectronics L3G4IS / InvenSense IDG-2020 / Maxim MAX21000 /

Sensonor STIM210 /Analog Devices ADIS16136

> Combo Accelero/Gyro 107

– Bosch SMI540 / InvenSense MPU-6500 /STMicroelectronics LSM330

> Magnetometers 125

– Freescale MAG3110 / Yamaha YAS532B / Alps Electric HSCDTD008A / ST LIS3MDL

> 6-Axis eCompass 148

– Bosch Sensortec BMC050 / STMicroelectronics LSM303D

> 9-Axis IMU 161

– STMicroelectronics LSM9DS0 / Bosch Sensortec BMX055 / InvenSense MPU-9150

• 2011 components under analysis (23) 179

> Accelerometers 1180

– ST LIS331DLH / ST LIS3DH/ Bosch Sensortec BMA180 / Bosch Sensortec BMA250 / Kionix KXTE9 / Freescale MMA8450 /

Freescale MMA8451 / Analog Device ADXL278 / AnalogDevice ADXL 346

> Gyroscopes 237

– Invensense IDG 1004 / Invensense IDG 600/650/ Invensense ITG3200 / ST L3G4200D / VTI CRM3000 / Sensordynamics SD740 /

 SSS Pinpoint CRM100 / Epson Toyocom XV-3500CB /Sony 2-Axis Gyro / Murata ENC-03RC-10-R A11

> Combo Accelero/Gyro 297

– SensorDynamics SD746 / VTI SCC1300 /Invensense MPU6000

> Magnetometer 313

> AKM AK8973S

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