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The MOSFET universe is wide and varied: discover all the different technologies used in industrial 100V MOSFETs and their related costs

Industrial 100V MOSFET Technology and Cost Review

Product code
EUR 6990
Automotive & Mobility Industrial
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These two reports present in-depth analyses of the latest innovations in 100V industrial MOSFET devices. They show the differences between 20 selected devices from Infineon, International Rectifier (IR), Fairchild, ON Semiconductor, Toshiba, Vishay and STMicroelectronics. All the major manufacturers on the market and their new technologies are thus covered.

The technology report details the manufacturing processes and materials used, packaging structures, component designs, die sizes, electrical performance and current densities. The cost report then compares the components’ electrical performance, technical choices and cost structure.

100V silicon MOSFETs are standard devices commonly used in many applications, such as automotive, industrial, computing and storage, home appliances and audio and imaging. The market for 41-100V discrete MOSFETs represented US$1.3B in 2016 and it is expected to be US$1.8B in 2022.

The technology report provides a unique opportunity to understand the technology choices, technology roadmaps and evolution. The cost report reveals the manufacturing costs of the major MOSFET manufacturers, to give the bases for optimal choices of components during design and integration.

In the reports, we analyze and compare products from the five main manufacturers. Among them Fairchild and IR have been recently acquired by ON Semiconductor and Infineon, respectively. These acquisitions will push the companies to choose, in the near future, between products in the portfolio, based on cost and performance.

The reports include comparisons of cost, foundries and electrical performances of the devices.

Price of each report if purchased separately : EUR 3,490

Bundle of two reports : EUR 6,000

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Overview / Introduction

  • Executive Summary
  • Reverse Engineering Methodology

Company Profile

Physical Analysis

  • Summary of the Physical Analysis
    • Package analysis
    • Package opening
    • Package cross-section
  • MOSFET Die
    • MOSFET die view and dimensions
    • MOSFET die process
    • MOSFET die cross-section
    • MOSFET die process characteristics
  • MOSFET Manufacturing Process

Company Services


Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile
MOSFET Manufacturing Process

  • MOSFET Die Front-End Process
  • MOSFET Die Fabrication Unit
  • Final Test and Packaging Fabrication unit

Cost Analysis

  • Summary of the Cost Analysis
  • Yields Explanation and Hypotheses
  • MOSFET Die
    • MOSFET die front-end cost
    • MOSFET die probe test, thinning and dicing
    • MOSFET die wafer cost
    • MOSFET die cost
  • Complete MOSFET
    • Assembled component costs
    • Summary of the assembly
    • Component cost

Price Analysis

  • Estimation of Selling Price

Company Services

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