PACKAGING

Discover Huawei’s key devices, advanced packaging technical choices and main suppliers.

Through a teardown of the Huawei P20 Pro, this report details more than 100 integrated circuit (IC) devices used in the cellphone’s main boards.

It will help you to identify the manufacturer and packaging, including its size, type and pitch, and function of the P20 Pro’s main ICs. A physical analysis of the main substrates highlights internal structures and technologies used for the printed circuit boards (PCBs).

The report includes teardown photos, detailed package identification and descriptions and is supplied with an Excel file summarizing the P20 Pro chipset and breaking it down by supplier, package or footprint.

• Overview/Introduction
• Executive Summary
• Physical Analysis
  • Views and dimensions of the P20 Pro
  • P20 teardown
  • Electronic board high definition photos
  • Main components markings, packaging type, dimensions, pitch, pin count  and identification
  • PCB surface, cross section and minimum line width
  • IC package breakdown
  • IC manufacturer design wins
  • IC package footprint

• Apple iPhone X Teardown and Identification of Key Components
• Wafer to Wafer Permanent Bonding Comparison 2018
• Thermal Management in Smartphones: Technology Comparison 2017
• MEMS Packaging: Reverse Technology Review
• Xiaomi Mi 8 Explorer Teardown and Identification of Key Components
• Oppo Find X Teardown and Identification of Key Components
• Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
• Mitsubishi J1- Series 650V High-Power Modules for Automotive
• 1200V Silicon IGBT vs SiC MOSFET Comparison 2018
• Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution