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Heimann Sensor 32 x 32-array thermopile LWIR image sensor with silicon lens

Product code
EUR 6990
Automotive & Mobility Industrial Medical Mobile & Consumer
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A small, easy to use, low-power, cheap non-contact temperature measurement for varying applications.

LWIR imaging is increasingly used in myriad applications, from consumer to industrial. Low-cost, large arrays (32 x 32 and more) are specifically adapted to smart home/smart building applications for occupant detection, popu-lation localization, population counting, fire detection, and more. For these large markets of many hundreds of millions units a year, thermopile sensors are cost-competitive compared to micro-bolometers.

Based on a low-definition, 32 x 32 thermopile sensor, Heimann Sensor’s HTPA32x32d is dedicated to these markets. Cheaper than a microbolometer and easier to integrate, the thermopile offers very good performance for applications that do not require high-resolution images and a high frame rate.

The thermopile array sensor consists only of a 0.5cm³ camera (with lens). The system is made easy for integrators with a digital I²C interface, and includes for the first time a silicon lens for low-cost applications. The 32 x 32 array sensor uses a 90µm pixel based on a thermopile technology for a very compact design.

This report provides a detailed teardown and cost analysis of the thermopile die, the silicon lens, the EEPROM die, and the packaging.

This report also includes a comparison between the characteristics of the new and previous versions of the thermopile sensors from Heimann Sensor, and a comparison with FLIR’s ISC1403 microbolometer. This latter comparison highlights differences in each company’s technical choices.

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Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile

  • Heimann Sensor

Physical Analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package
    • Package views, dimensions and marking
    • Package opening
  • Silicon Lens
    • View, dimensions
    • Cross-section and lens coating
  • EERPOM Die
  • Thermopile Die
    • View, dimensions and marking
    • Pixels, thermocouples
    • Cross-section
    • ROIC characteristics
    • Process characteristics

Comparison – Heimann Sensor HTPA32x32d vs. Flir ISC1403L

Manufacturing Process Flow 

  • Global Overview
  • EEPROM Front-End Process and Wafer Fabrication Unit
  • ROIC Front-End Process and Wafer Fabrication Unit
  • Thermopile Front-End Process and Wafer Fabrication Unit
  • Thermopile Back-End 0: Probe Test and Dicing
  • Silicon Lens Front-End Process
  • Back-End – Final Test

Cost Analysis

  • Synthesis of the Cost Analysis
  • Yields Explanation and Hypotheses
    • EEPROM die – front-end cost + Wafer and die cost
    • Silicon lens – front-end cost + Wafer and die cost
    • Thermopile die – front-end cost + wafer and die cost
  •  Component
    • Back-end – packaging cost
    • Back-end – final test cost
    • Component cost

 Estimated Price Analysis

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