MEMS FingerPrint

Latest cost-optimized optical fingerprint sensor in the Huawei P30 Pro smartphone.

Synaptics launched the first optical fingerprint scanner on the market in 2018, with a lens-free solution. It was quickly followed by Goodix, also with a lens-free solution. This year, Goodix has launched its second generation optical fingerprint scanner, the first such product to use a lens.

The latest Goodix under-display optical fingerprint scanner has been found in Huawei P30 and P30 Pro, Vivo X23 and NEX S and other smartphones.

This scanner uses optical fingerprint technology that allows integration under the display. The new Goodix technology is radically different from those previously observed. Adding lenses reduces the pixel and CMOS image sensor die areas drastically, while keeping the same scanning area. The sensor die area and cost are much reduced.

Moreover, Goodix has developed a versatile interface component to reduce development time and cost. The sensor and interface component are assembled on an easily-customizable flex to adapt the fingerprint scanner to different smartphones.

The sensor has a resolution of 39,000 pixels, with a pixel density of 5,080ppi. The module’s light source is provided by the OLED display. The sensor is connected by wire bonding to the flexible printed circuit and uses a CMOS process.

This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the fingerprint sensor supplied by Goodix. It also compares it with the latest Synaptics fingerprint sensor in Vivo x21 and with the previous version of Goodix’s design.

Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile: Goodix

Physical Analysis

• Summary of the Physical Analysis
• Huawei P30 Pro Fingerprint Scanner Disassembly
  • Optical fingerprint removal
• Goodix Package Assembly
  • Optical fingerprint views
  • Optical fingerprint cross-section
• Sensor Die
  • Sensor die view and dimensions
  • Sensor delayering, main blocks and process
  • Sensor die cross-section and process characteristics
• Interface Component
  • Flash die, PMIC die, MCU die
• Goodix 2017 vs Goodix 2019
• Goodix vs Synaptics FS9500 fingerprint sensor

Sensor Manufacturing Process

• Sensor Die Front-End Process and Fabrication Unit
• Interface Component Front-End Process and Fabrication Unit
• Final Test and Assembly Unit

Cost Analysis

• Summary of the Cost Analysis
• Yield Explanations and Hypotheses
• Interface Component
  • Flash die cost, PMIC die cost, MCU die cost
• Sensor Die
  • Sensor die front-end cost
  • Sensor die probe test, thinning and dicing
  • Sensor die wafer cost
  • Sensor die cost
• Complete Module Fingerprint
  • Assembled component costs
  • Summary of the assembly
  • Fingerprint component cost

Goodix TC2403 (Huawei P30 Pro) vs Synaptics FS9500  (Vivo X21 UD)

Selling Price

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