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MEMS Compass

Freescale MAG3110 3-Axis Electronic Compass

Published
16/04/2012
Product code
SP12089
Price
EUR 1 990
Applications
Consumer
Available sample Available flyer Ask for info

System Plus Consulting is proud to publish the reverse costing report of the 3-axis electronic compass supplied by Freescale Semiconductor.

The MAG3110 is a 3-axis digital magnetometer using Magnetic Tunnel Junction (MTJ) principle. The manufacturing of the sensor is realized by Everspin Technologies, a leader in MRAM products.

Compatible with SMD process, the component is provided in a standard 2x2x0.85mm DFN 10-pin package.

The MAG3110 is suitable for various applications including Electronic Compass, Dead-reckoning assistance for GPS backup and Location-based Services.

This report provides complete teardown of the sensor with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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Glossary

 Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

 Companies Profile

  • Freescale/Everspin Profil
  • MAG3110 Characteristics
  • Business Model

 Physical analysis

  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package X-Ray
  • Package Cross-Section
  • Package Opening
  • ASIC Dimensions
  • ASIC Markings
  • ASIC Cross-Section
  • Sensor Dimensions
  • Sensor Markings
  • Sensor Cross-section
  • X(Y)-Axes Sensors Cross-section
  • X(Y)-Axes Sensors Delayering
  • X(Y)-Axes MTJ Structure Cross-Section
  • Z-Axis Sensor Delayering
  • Z-Axis Sensor Cross-Section

Manufacturing Process Flow

  • Overview
  • ASIC Process
  • Sensor Process
  • Description of the Wafer Fabrication Units

 Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Yields Hypotheses
  • Die per wafer & Probe Test
  • ASIC Front-End : Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
  • ASIC Die Cost
  • Sensor Front-End : Hypotheses
  • Sensor Front-End Cost
  • Sensor Back-End 0 : Probe Test & Dicing
  • Sensor Die Cost (Front End + Back End 0)
  • Back-End 1 : Packaging Cost
  • Back-End 1 : Final test & Calibration Cost
  • MAG3110 Component Cost (FE + BE 0 + BE 1)

 Estimated Price Analysis

 Conclusion

 

 

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