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Freescale FXTH87 – MEMS TPMS

Product code
EUR 6990
Automotive & Mobility
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Pressure sensor market growth is mainly driven by TPMS due to legislation and quick adoption around the world.

The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest footprint with 7x7mm², the smallest RF power consumption with 7mA Idd and the largest customer memory size with 8kB flash.

This system in package includes a dual-axis accelerometer (XZ), pressure and temperature sensors, an integrated MCU, a RF transmitter and a low frequency receiver. It is 40% smaller than Freescale’s previous-generation QFN 9x9mm package and 50% smaller than Infineon SP37 TPMS solution .

The pressure sensor is based on Freescale’s MEMS capacitive pressure cell without signal conditioning. The accelerometer included in the FXTH87 can be a single axis (Z) or a dual axis (XZ) and is manufactured with Freescale’s surface micromachining poly-Si MEMS process.

Assembled in a Film-Assisted Molding (FAM) 7x7mm QFN package with gel fill, the FXTH87 is certified AEC-Q100 and qualified for operating temperature range from -40°C to +125°C.

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Overview/Introduction , Freescale Company Profile

Physical Analysis

  • Package
    • Package Views & Dimensions
    • Package Opening & Wire Bonding Proces
    • Package Cross-Section
  • ASIC Die
    • View, Dimensions & Marking
    • Delayering & Main Blocks Identificatio
    • Cross-Section & Process Characteristics
  • MEMS Pressure Sensor Die
    • View, Dimensions & Marking
    • Sensing Area Detail
    • Cross-Section & Process Characteristics
  • MEMS Accelerometer Die
    • View, Dimensions & Marking
    • Cap Opening & Cap Détails
    • Sensing Area Détail
    • Cross-Section & Process Characteristics
  • Freescale TPMS Evolution (MPXY8300, MPXY8600, FXTH87)
  • Comparison with Infineon SP37

Manufacturing Process Flow

  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Pressure Sensor Process Flow
  • MEMS Accelerometer Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Pressure Sensor Front-End Cost
  • MEMS Pressure Sensor Cost per process steps
  • MEMS Pressure Sensor Wafer & Die Cost
  • MEMS Accelerometer Front-End Cost
  • MEMS Accelerometer Cost per process steps
  • MEMS Accelerometer Wafer & Die Cost
  • Back-End : Packaging & Final Test Cost
  • FXTH87 TPMS Component Cost & Price
  • Cost Comparison with Infineon SP37
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