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MEMS Gyroscope

Epson Toyocom X3500W – QMEMS Gyro

Published
24/03/2010
Product code
SP10027
Price
EUR 1 990
Applications
Consumer
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System Plus Consulting is proud to publish the reverse costing report of the yaw rate sensor X3500W supplied by Epson Toyocom.

This Z-axis gyroscope use an hermetically sealed multi-chip Ceramic LCC package with two dies: : a Quartz crystal sensor die processed with MEMS technology (QMEMS) and an ASIC die for signal conditioning.

The X3500W is integrated in the Nintendo Wii Motion Plus accessory. It is a variation of the standard XV-3500CB from Epson Toyocom which is mainly used for image stabilization of DVC and DSC or for the detection of moving with human machine interface.

This report provides a complete teardown of the QMEMS Gyroscope with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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Glossary

 Overview / Introduction

 Epson Toyocom Company Profile

  •  Physical Analysis
  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package Opening
  • Device Structure
  • ASIC Markings
  • ASIC Dimensions
  • ASIC Poly & Metal Layers
  • ASIC Main Blocks
  • ASIC Process Characteristics
  • QMEMS Dimensions
  • QMEMS Structure
  • Gyro Principle : Double-T Structure
  • QMEMS Details
  • Component Cross-Section
  • MEMS process characteristics

Manufacturing Process Flow

  • Overview
  • ASIC Process Flow
  • MEMS Process Flow

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Supply Chain Analysis
  • Manufacturers financial ratios
  • Yields Explanation
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test and Dicing
  • Die per wafer & Probe Test
  • ASIC Total Wafer Cost (Front-End + Back-End 0)
  • ASIC Die Cost
  • QMEMS Front-End Cost
  • QMEMS Front-End Cost per Process Steps
  • QMEMS Front-End : Equipment Cost per Family
  • QMEMS Front-End : Material Cost per Family
  • QMEMS Back-End 0 : Test/Trimming
  • QMEMS Back-End 0 : Bumping & Dicing
  • QMEMS Total Wafer Cost (Front-End + Back-End 0)
  • QMEMS Die Cost
  • X3500W Packaging Process Flow
  • X3500W Packaging Cost
  • X3500W Final Test Cost
  • X3500W Component Manufacturing Cost
  • Yield Synthesis

 Estimated Manufacturer Price Analysis

Conclusion

 

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