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Continental SRL1: LiDAR for Advanced Driver Assistance Systems (ADAS) related equipment - cost-effective solution for emergency brake assist (EBA)

Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems

Product code
EUR 2 990
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Light detection and ranging (LiDAR) sensing has a wide spectrum of applications, one of which is in autonomous or “self-driving” cars. LiDAR is therefore attracting attention from the automotive industry, as well as other fields. However, until now, systems haven’t matched challenging automotive specifications for reliability, compact-ness, and cost-efficiency.

Based on rugged design and components, the SRL-1 from Continental provides a reliable and efficient solid-state LiDAR for frontal impact detection without any mechanical movement. Detecting collisions in an urban environment at speeds up to 50km/h, including an emergency braking assist (EBA) function, makes this product a great asset for today’s autonomous and assisted driving needs.

A mature but efficient strained InAlGaAs/GaAs quantum well-structure laser photodiode from OSRAM is the SRL-1’s light emitter. This choice reduces costs and enables measurement of the distance to objects without a reflector. The SRL-1 uses the time-of-flight technique with a very high repetition rate thanks to a Freescale processing chipset and application specific integrated circuit (ASIC).

The integration and design of the system provide a light and compact system. It can therefore be used in several types of personal or industrial vehicle without being too invasive. That design also keeps its price low relative to competing products. This report details the full Continental SRL1 system’s manufacturing and packaging processes, as well as an estimation of the manufacturing cost and selling price.

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Overview / Introduction

Company Profile

System Physical Analysis

  • Views and Dimensions
  • System Opening and Overview
  • Mother Board
    • Top side – overview
    • Top side – high definition photo
    • Top side – PCB markings
    • Top side – main component markings
    • Top side – main component identification
    • Top side – other component markings
    • Top side – other component identification
    • Bottom side – high definition photo
    • Bottom side – component identification
  • Daughter Board

Cost Analysis

  • Accessing the BOM
  • PCB Cost
  • ASIC Estimation Cost
  • BOM Cost – Electronic Boards
  • BOM Cost – Housing
  • Material Cost Breakdown
  • Accessing the Added Value (AV) Cost
  • Electronic Boards Manufacturing Flow
  • Details of the Housing Assembly and Functional Test Costs
  • Added Value Cost Breakdown
  • Manufacturing Cost Breakdown

Selling Price

  • Estimation of the Manufacturing Price
  • Estimation of the Selling Price
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