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Continental attempts to penetrate the forward camera market with MFC430TA, a distinctive architecture and cost effective solution for ADAS

Continental MFC430TA – Forward Automotive Camera for Advanced Driver Assistance Systems

Product code
EUR 2 990
Available sample Available flyer Ask for info

The fourth generation of Continental’s forward looking Multi-Function Mono Camera, MFC430, is trying to catch up in the Asian market for forward cameras for Advanced Driver Assistance Systems (ADAS).

This version provides driver assistance functions like lane departure warning, traffic sign assist and intelligent headlamp control. In addition, object detection for forward collision warning and pedestrian detection is available.

The MFC430 camera architecture is based on an innovative system-on-chip from Texas Instruments implemented with a self-diagnosis system for the recognition of problems such as contamination, as well as imager and central processing unit functions. Integration and cost optimized design makes it one of the cheapest options among forward cameras for ADAS.

Based on a teardown of the system, this report details a complete bill of material, and the camera’s manufacturing and packaging processes. Electronics, housing and imaging are presented in the report as well as the physical analysis of the CMOS Imaging System. An estimation of the manufacturing cost and selling price is included.

This report is best when used to compare design architecture and price analyses of the other main players’ cameras such as Bosch’s MPC2 and TRW’s SCam-3. In fact, a complementary comparative analysis of the three cameras will be provided to everyone who buys our three reports in a bundle.

Benefit from a bundle offer with the TRW S-Cam 3 and Bosch MPC2 reports – Contact us!

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Overview / Introduction

  • Executive summary
  • Reverse costing methodology

Company Profile

  • Continental

Physical Analysis

  • Views and Dimensions of the System
  • System Opening
  • Camera Module
  • Image Sensor Board
    • Top side – overview, high definition photo and main component identification
    • Bottom side – high definition photo
  • Electronic Board
    • Top side – overview, high definition photo, main component markings and identification, other component markings and identification
    • Bottom side – high definition photo and component identification
  • CMOS Image Sensor
    • Package view and dimensions
    • Package disassembly
    • CIS – die view and cross-Section

Cost Analysis

  • Accessing the BOM
  • PCB Cost
  • CIS Process Characteristics
  • Cost Estimation of the ON Semiconductor CIS
  • BOM Cost – Electronic Board and Image Sensor Board
  • Housing Parts – Estimation
  • BOM Cost – Housing
  • Material Cost Breakdown by Sub-Assembly and by Component Category
  • Accessing the Added Value (AV) cost
  • Details of Electronic Board, Image Sensor Board and the System Assembly AV Cost
  • Manufacturing Cost Breakdown

Estimated Price Analysis

  • Estimation of the Manufacturing Price
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