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SYSTEM Automotive

Continental ARS4-A 77GHz Radar

Published
14/03/2017
Product code
SP17321
Price
EUR 2 990
Applications
Automotive
Available sample Available flyer Ask for info

The Continental ARS4-A Radar is designed for forward collision warning, emergency brake assist, collision mitigation system or Adaptive Cruise Control (ACC). A special feature of the device is the simultaneous measurement of long distances, up to 250m with +/-0.2m accuracy, and short range, up to 70m, relative velocity and angle between two objects. It is thus able to detect stationary objects without any camera support.

The system integrates two electronic boards including an NXP Semiconductor microcontroller and Broadcom Ethernet transceiver. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.

The NXP Semiconductor multi-channel 77 GHz radar transceiver chipset, composed of four receivers, two transmitters and an associated voltage controlled oscillator (VCO), is used as high-frequency transmitter and receiver. The RF dies are packaged in redistributed chip package (RCP) fan-out wafer level packages initially developed and manufactured by Freescale.

Based on a complete teardown analysis of the Continental radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor.

A complete physical analysis and manufacturing cost estimation of the NXP semiconductor monolithic microwave integrated circuits (MMICs) is available in a separate report.

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Overview / Introduction

  • Executive Summary
  • Company Profile
  • Reverse Costing Methodology

Physical Analysis

  • Overview of the Radar
  • Views and Dimensions of the Radar
  • Radar Opening
  • Electronic Boards
  • MCU Board
  • Overview
  • High Definition Photo
  • Component Markings and Identification
  • RF Board
  • Overview
  • High Definition Photo
  • Component Markings and Identification
  • RF Chipset Analysis
  • Comparison with Autoliv MMRV1 and Bosch MMR1

Cost Analysis

  • PCB Cost
  • RF Board Cross Section and EDX Analysis
  • Estimation of the Cost of the NXP Semiconductor MCU
  • BOM Cost – MCU Board
  • BOM Cost – RF Board
  • BOM Cost – Housing
  • Material Cost Breakdown
  • Accessing the Added Value (AV) Cost
  • MCU Board Manufacturing Flow
  • RF Board Manufacturing Flow
  • Details of the Housing Assembly and Functional Test Costs
  • Added Value Cost Breakdown
  • Manufacturing Cost Breakdown

Estimated Price Analysis

  • Estimation of the Manufacturing Price
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