MEMS Microphone

Consumer MEMS Microphones Comparison 2020

Published: 12/02/2020
Product code: SP20458
Price: EUR 6 490
Applications: Consumer

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Introduction
Summary
Similar reports

Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.

The consumer MEMS microphone market is expected to be worth $1.5B in 2024, up from $1.1B in 2019, according to the “Microphones, Microspeakers and Audio Solutions” report from Yole Développement. The main drivers are smart speakers and wireless earbuds. Two main players share the MEMS microphone market, Knowles and Goertek, with market shares of 39% and 28%, respectively.

In this dynamic context of the consumer microphone market, System Plus Consulting provides a deep comparative review of the technology and cost of 19 MEMS microphones. They come from the main microphone suppliers on the market: Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic, and Vesper.

System Plus Consulting analyzes several microphone technologies to provide insights about their structures, processes and costs. We look at their packages structure, dimensions and substrate. Application specific integrated circuit ASIC technology size and technology node are analyzed, MEMS dies, dimensions, technology and internal structure are studied in order to determine each manufacturing process.
The supply chain and cost of each MEMS microphones have been calculated.
Finally, the innovations and technology evolution of each manufacturer are noted and compared.
This report includes an overview of the microphones used by the main smartphone suppliers in the market.

Overview/Introduction

Executive Summary
Reverse Costing Methodology

Company Profile

Market
Main Smartphone’s microphones integration
Company Profile and Supply Chain

Physical Analysis

Knowles
Goertek
AAC Technologies
STMicroelectronics
TDK-InvenSense
TDK-Epcos
Cirrus Logic
Vesper
For each microphone supplier:
- Microphone overview : Package, ASIC, MEMS
- Package cross-section
- MEMS die design and cross-section
- Technology evolution and physical comparisons of packages, MEMS, and ASIC dies for each manufacturer and between the manufacturers

MEMS Manufacturing Process

Knowles
Infineon
STMicroelectronics
InvenSense
Wolfson
Vesper

Technology Comparison

Microphone Package Comparison
Microphone MEMS Comparison

Cost Analysis

Yield Explanations and Hypotheses
Overall Comparison – Microphone Component Cost
Overall Comparison – MEMS Wafer FE Cost and Die Cost
Microphone Component Cost Breakdown
Conclusions