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IC & RF Integrated Circuit

BCM89501 Broadcom Package System Plus Consulting

Broadcom BCM89501

Published
03/05/2016
Product code
SP16270
Price
EUR 2 490
Applications
Automotive
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Ethernet technology in automotive should see massive adoption in the coming years, with up to a half-billion Ethernet ports deployed in cars by 2020, according to Strategy Analytics. Starting with Europe, the standardization of one-pair Ethernet technology by OPEN and IEEE, based on Broadcom’s BroadR-Reach, has led to a strong increase with ~300 automotive and technology companies now involved.

The BCM89501 uses Broadcom’s high-performance BroadR-Reach Ethernet technology, the world’s first Ethernet automotive solution, to deliver 100Mbps over unshielded single-twisted pair cable. This technology for automotive central gateway, Advanced Driver Assistance (ADAS), and infotainment is on the road today in a wide range of vehicles, and according to Broadcom it reduces connectivity cost by up to 80% and cabling weight by as much as 30%.

The BCM89501 is a highly-integrated 7-port switch with five embedded PHYs. The component is provided in a thermally-enhanced eLQFP 176-pin package and delivers the most comprehensive automotive technology solution required by OEM and Tier 1 suppliers, with automotive grade-2 temperature, AEC-Q100, and TS16949 certifications.

Built with a 65nm technology, the circuit integrates an ARM Cortex R4 processor and a large amount of on-chip SRAM. This report, based on a complete physical analysis of the chip, provides an estimated manufacturing cost and selling price along with forecasts for the coming years.

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Overview/Introduction

Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • Package Analysis
    • Package view, dimensions, and marking
    • Package marking
    • Package cross-section
  • Die Analysis
    • Die view, dimensions, and marking
    • Die delayering
    • Main blocks area ratio
    • Die process (CMOS transistors, SRAM, ROM)
    • Die cross-section (die thickness, metal layers, transistor)
    • Die process characteristics

Cost Analysis

  • Synthesis of the Cost Analysis
  • Manufacturing Locations Hypotheses
    • Wafer fabrication unit
    • Packaging
    • Tests
  • Component Cost Analysis
    • Wafer front-end cost
    • Probe test & dicing cost
    • Die cost
    • Packaging cost
    • Final test cost
    • Component cost

Estimated Price Analysis

  • Manufacturer financial ratios
  • Estimated sales price
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