IC & RF Integrated Circuit

BCM89501 Broadcom Package System Plus Consulting

Broadcom BCM89501

Published: 03/05/2016
Product code: SP16270
Price: EUR 2 490
Applications: Automotive

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Introduction
Summary
Similar reports

Ethernet technology in automotive should see massive adoption in the coming years, with up to a half-billion Ethernet ports deployed in cars by 2020, according to Strategy Analytics. Starting with Europe, the standardization of one-pair Ethernet technology by OPEN and IEEE, based on Broadcom’s BroadR-Reach, has led to a strong increase with ~300 automotive and technology companies now involved.

The BCM89501 uses Broadcom’s high-performance BroadR-Reach Ethernet technology, the world’s first Ethernet automotive solution, to deliver 100Mbps over unshielded single-twisted pair cable. This technology for automotive central gateway, Advanced Driver Assistance (ADAS), and infotainment is on the road today in a wide range of vehicles, and according to Broadcom it reduces connectivity cost by up to 80% and cabling weight by as much as 30%.

The BCM89501 is a highly-integrated 7-port switch with five embedded PHYs. The component is provided in a thermally-enhanced eLQFP 176-pin package and delivers the most comprehensive automotive technology solution required by OEM and Tier 1 suppliers, with automotive grade-2 temperature, AEC-Q100, and TS16949 certifications.

Built with a 65nm technology, the circuit integrates an ARM Cortex R4 processor and a large amount of on-chip SRAM. This report, based on a complete physical analysis of the chip, provides an estimated manufacturing cost and selling price along with forecasts for the coming years.

Overview/Introduction

Company Profile

Physical Analysis

Physical Analysis Methodology
Package Analysis
- Package view, dimensions, and marking
- Package marking
- Package cross-section
Die Analysis
- Die view, dimensions, and marking
- Die delayering
- Main blocks area ratio
- Die process (CMOS transistors, SRAM, ROM)
- Die cross-section (die thickness, metal layers, transistor)
- Die process characteristics

Cost Analysis

Synthesis of the Cost Analysis
Manufacturing Locations Hypotheses
- Wafer fabrication unit
- Packaging
- Tests
Component Cost Analysis
- Wafer front-end cost
- Probe test & dicing cost
- Die cost
- Packaging cost
- Final test cost
- Component cost

Estimated Price Analysis

Manufacturer financial ratios
Estimated sales price