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Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series

Published
04/03/2020
Product code
SP20521
Price
EUR 3 990
Applications
Consumer
Available sample Available flyer Ask for info

Cost effective third generation of mid/high band Front-End Module with advanced and innovative packaging.

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Staying true to its choices for each previous iPhone series iteration Apple has again selected an innovative Radio Frequency (RF) Front-End Module (FEM) for its flagship. Each year Broadcom, its faithful supplier, has advanced its filters and innovative packaging technology in order to compete with the other market players and maintain its contract. This year, for the first time, Broadcom chose double side Ball Grid Array (BGA) packaging coupled to new Electro-Magnetic Interference (EMI) shielding to enable a very high-density System-in-Package (SiP) with frequency band sharing.

In 2019, Broadcom remains the only supplier of the same module for several versions of the latest Apple iPhone series: 11, 11 Pro and 11 Pro Max. Like its predecessor, the AFEM-8092, the AFEM-8100 is a Mid- and High-Band (MB and HB) Long Term Evolution (LTE) FEM. It features several dies, including Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film Bulk Acoustic Resonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-Scale Packaging (CSP) technology with Through-Silicon Vias (TSVs) enabling electrical contacts and scandium doped aluminum nitride (AlScN) as a piezoelectric material.

For this special version, Broadcom has innovated in several directions. Thanks to the double side BGA technology, the packaging is denser and the critical master switches and Low-Noise Amplifier dies have been completely isolated from the filtering part. In the EMI Shielding, a new integration method has allowed a huge reduction in the packaging cost. Finally, with the latest GaAs PA technology using Flip-Chip configuration, the PA area has shrunk by 30 %. Thanks to all these innovations, Broadcom is able to supply a cost-effective new component with fewer input/output (I/O) connections.

The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, the LNA, the filtering dies, and the internal/external EMI shielding. The report also features a cost analysis and a price estimation of the component. Finally, it also integrates a comparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X and the AFEM-8092, MB/HB LTE FEM in the Apple iPhone Xs.

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

Broadcom AFEM-8100 System-in-Package in the Apple iPhone 11 Series - System Plus Consulting

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Overview/Introduction

Broadcom Company Profile

Apple iPhone 11 Pro Max – Teardown

Market Analysis

Physical Analysis

  • Package
    • View and dimensions
    • Package opening: Power amplifier, switch, RF IC, filters
    • Block diagram estimation
    • Package cross-section: overview, dimensions, substrate, internal and external shielding
  • Package Physical Data Summary
  • Power Amplifier, Switch, LNA Dies
    • Views, dimensions, and markings
    • Die overview and cross-section
  • Filter Dies
    • Views, dimensions, opening and markings
    • Die overview: cap, substrate, cells
    • Die cross-section: sealing frame, anchor, TSV, holes, FBAR structure

Manufacturing Process Flow

  • LNA, Switch Die Process and Wafer Fabrication Unit
  • PA Wafer Fabrication Unit and Process Flow
  • Filter Wafer Fabrication Unit and Process Flow
  • Packaging Process Flow

Cost Analysis

  • Yield Hypotheses
  • PA Die Cost
    • PA wafer front-end cost per process step
    • Wafer and die cost
  • Switch, LNA Die Cost
    • Front-End (FE), wafer and die cost
  • Filter Die Cost
    • Filter wafer front-end cost per process step
    • Wafer and die cost
  • Packaging Cost
  • Module Cost

Estimated Price Analysis

Comparison with Previous Mid/High Band FEMs from Broadcom: AFEM-8092 and AFEM-8072

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