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Bosch Sensortec BMI160

Product code
EUR 2 990
Available sample Available flyer Ask for info

Bosch is now the top MEMS supplier with a production of more than 4 millions MEMS per day. This strong growth is due to both consumer applications and automotive applications.

With a size of only 7.5mm² (3×2.5mm), the BMI160 is the smallest 6-Axis IMU MEMS on the market and features 60% volume reduction compared to previous BMI055. This size reduction has been made possible by the use of a new design and process for the MEMS Gyro and by the integration in one ASIC die for the control of both MEMS. The BMI160 is a 16-bit digital resolution accelerometer and gyroscope well suited for applications requiring extremely small form factors.

Bosch has worked on the power consumption with a low power mode for the significant motion and step detector functions, using a “7-axis” accelerometer. Moreover, the unique ASIC die can perform the fusion of the data from the accelerometer and gyroscope with those from an external sensor.

The report is including a detailed technical and cost comparison with the previous generation BMI055 and the state of the art 6-Axis MEMS IMU from Invensense.

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Introduction, Bosch Sensortec Company Profile

Physical Analysis

  • Package
    • Package Views & Dimensions
    • Package Openin
    • Package Cross-Section
  • ASIC Die
    • View, Dimensions & Marking
    • Delayering
    • Main Blocks Identification
    • Process Identificatio
    • Cross-Section
  • MEMS Die
    • View, Dimensions & Marking
    • Bond Pad Opening
    • Cap Removed & Cap Details
    • Sensing Area Details
    • Cross-Section (Sensor, Cap & Sealing
    • Process Characteristics
  • Consumer 6-Axis MEMS IMU Comparison (Bosch Sensortec BMI055 & BMI160, Invensense)

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process & Wafer Fab Unit
  • MEMS Process Flow & Wafer Fab Unit
  • Package Process Flow & Assembly Unit

Cost Analysis

  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Gyro & Accelero Front-End Cost
  • MEMS Gyro & Accelero Front-End Cost per process steps
  • MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing
  • MEMS Gyro & Accelero Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Final Test & Calibration Cost
  • BMI160 Component Cost
  • Consumer 6-Axis IMU Comparison

Estimated Price Analysis

Consumer 6-Axis MEMS IMU Cost Comparison (Bosch Sensortec BMI055 & BMI160, Invensense)


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