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Bosch Sensortec BMC150 6-Axis MEMS eCompass

Product code
EUR 6990
Mobile & Consumer
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The BMC150 combines a 12-bit 3-Axis accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2×2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. The MEMS accelerometer is also an evolution of the one found in BMC050.

The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications.



  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation


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Overview/Introduction , Bosch Company Profile

 Physical Analysis

  • Package
  • Package Views, Dimensions & X-Ray
  • Package Opening
  • Wire bonding Process
  • Package Cross-Section
  • Accelerometer ASIC Die
  • View, Dimensions & Marking
  • Process Identification
  • Cross-Section
  • Accelerometer MEMS Die
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Bonding)
  • Process Characteristics
  • Magnetometer Die
  • View, Dimensions & Marking
  • Hall sensor and fluxgate sensors
  • Delayering
  • Main Blocks Identification
  • Cross-Section (CMOS & Sensor)

 Manufacturing Process Flow

  • ASIC Accelero Front-End Process
  • MEMS Accelero Process Flow
  • Magnetometer Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

 Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Wafer & Die Cost
  • Magnetometer CMOS Front-End Cost
  • Magnetometer Sensor Cost
  • Magnetometer Sensor Cost per process steps
  • Magnetometer Back-End 0 : Probe Test & Dicing
  • Magnetometer Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Final Test Cost
  • BMC150 Component Cost

 Estimated Price Analysis


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