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MEMS Accelerometer

Bosch Sensortec BMA250 : MEMS 3-Axis Accelerometer

Published
13/12/2011
Product code
RM074
Price
EUR 1 990
Applications
Consumer
Available sample Available flyer Ask for info

System Plus Consulting is proud to publish the reverse costing report on the BMA250 3-axis MEMS accelerometer from Bosch Sensortec.

The BMA250 is a low power digital accelerometer packaged in in a tiny 2x2x0.9mm³ QFN package.

Major changes in the MEMS process were necessary to reduce the die area and the overall thickness.

The BMA250 is targeted for game controllers, mobile handsets, digital still and video cameras, 3D remote controls/mice, portable navigation devices, security and health.

 

This report provides complete teardown of the inertial MEMS with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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1. Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

2. Bosch Sensortec Company Profile

  • Bosch Sensortec
  • BMA250 Specifications & Block Diagram

3. Physical Analysis

  • Package Characteristics & Markings
  • Package Opening & Bonding Number
  • Device Structure
  • ASIC – Dimensions
  • ASIC – Markings & Bond Pads
  • ASIC – Functions
  • ASIC Synthesis
  • MEMS Sensor – Dimensions and Marking
  • MEMS Sensor – X-Axis SEM Views
  • MEMS Sensor – Y-Axis SEM Views
  • MEMS Sensor – Z-Axis SEM Views
  • MEMS Sensor – Capacitances electrodes
  • Component Cross-Section
  • MEMS Cross-Section AA‘
  • MEMS Cross-Section BB
  • Physical Data Summary
  • MEMS process characteristics
  • Comparisons with Previous Generation

4. Manufacturing Process Flow

  • Global Overview
  • ASIC Process Flow
  • Description of the ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • Description of the MEMS Wafer Fabrication Unit

5. Cost Analysis

  • Yields Explanation
  • Die per wafer & Probe Test
  • ASIC Wafer Front-End Cost
  • ASIC Die Cost
  • MEMS Wafer Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • MEMS Back-End 0 : Probe Test & dicing
  • MEMS Die Cost
  • Back-End 1 : Packaging, Final test, calibration
  • BMA250 Component Cost (FE + BE 0 + BE 1)
  • Yields Synthesis

6. Estimated Manufacturer Price Analysis

  • Supply Chain Analysis
  • Manufacturers financial ratios
  • Estimated Manufacturer Price

Conclusion

 

 

 

4. Manufacturing Process Flow…………………………..….49

Global Overview
ASIC Process Flow
Description of the ASIC Wafer Fabrication Unit
MEMS Process Flow
Description of the MEMS Wafer Fabrication Unit

5. Cost Analysis……………………………………………..…..64

Yields Explanation
Die per wafer & Probe Test
ASIC Wafer Front-End Cost
ASIC Die Cost
MEMS Wafer Front-End Cost
MEMS Front-End Cost per Process Steps
MEMS Front-End : Equipment Cost per Family
MEMS Front-End : Material Cost per Family
MEMS Back-End 0 : Probe Test & dicing
MEMS Die Cost
Back-End 1 : Packaging, Final test, calibration
BMA250 Component Cost (FE + BE 0 + BE 1)
Yields Synthesis

6. Estimated Manufacturer Price Analysis …………………87

Supply Chain Analysis
Manufacturers financial ratios
Estimated Manufacturer Price

Conclusion ……………………………………………………….91

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