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LRR4 77GHz, the fourth generation of Bosch long range radar sensor sets new standards for a more elegant, compact and cost effective module - System Plus Cosulting

Bosch LRR4 77GHz Long Range Radar Sensor

Product code
EUR 2 990
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The LLR4 is a monostatic multimodal radar in a very compact and elegant housing and uses, like its predecessors, the 77 gigahertz (GHz) frequency band. The main innovation in this fourth generation is the number of radar beams used, with six fixed radar antennas instead of four for the third generation. The LRR4 can detect other vehicles at a distance of roughly 250 meters. It enables Adaptive Cruise Control (ACC) at speeds of more than 160km/h, which can make up for large differences in speed without any intervention by the driver. The radar is equipped with a heated lens which ensures full sensor availability, even in poor weather conditions, such as snow and ice.

The system integrates two electronic boards, including NXP Semiconductor and STMicroelectronics microcontrollers and Bosch power management ICs. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.

Infineon 77GHz SiGe Monolithic Microwave Integrated Circuits (MMICs) are used as high-frequency transmitter and receiver. The two RF dies are packaged in the latest version of the eWLB Fan-Out Wafer Level Package developed and manufactured by Infineon.

Based on a complete teardown analysis of the Bosch radar, the report provides the bill-of-material (BOM) and the manufacturing cost of the radar sensor as well as a comparison with Continental’s ARS4-A and Bosch’s MRR1Plus modules.

A complete physical analysis and manufacturing cost estimation of the Infineon MMICs is available in a separate report.

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Overview / Introduction

  • Executive Summary
  • Company Profile and Main Features
  • Reverse Costing Methodology

Physical Analysis

  • Global View of the Radar
  • Views and Dimensions of the Radar
  • Radar Opening
  • Radar Dome Opening
  • Electronic Boards
  • MCU Board
  • Overview
  • High Definition Photo
  • Component Markings and Identification
  • RF Board
  • Overview
  • High Definition Photo
  • Component Markings and Identification
  • RF Chipset Analysis
  • Comparison with Continental ARS4-A and Bosch MMR1

Cost Analysis

  • PCB Cost
  • RF Board Cross Section and EDX Analysis
  • Estimation of the Cost of the NXP semiconductor MCU
  • BOM Cost – MCU Board
  • BOM Cost – RF Board
  • BOM Cost – Housing
  • Material Cost Breakdown
  • Accessing the Added Value (AV) cost
  • MCU Board Manufacturing Flow
  • RF Board Manufacturing Flow
  • Details of the Housing Assembly and Functional Test Costs
  • Added Value Cost Breakdown
  • Manufacturing Cost Breakdown

Estimated Price Analysis

  • Estimation of the Manufacturing Price
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