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SYSTEM Automotive

Autoliv 77GHz Multi Mode Radar, a compact, cost-effective and high-performance driving assistance system combining medium- and long-range detection

Autoliv 77GHz Multi Mode Radar

Published
24/01/2017
Product code
SP17312
Price
EUR 2 990
Applications
Automotive
Available sample Available flyer Ask for info

Autoliv, one of the leading automotive radar system suppliers, has developed a new radar configuration. Instead of installing two radar systems, one for long range and another for medium range, the 77GHz Multi Mode Radar combines both. By expanding the detection area of the radar, Autoliv significantly reduces the cost of safety equipment.

The system integrates two electronic boards including Texas Instruments’ microcontroller and automotive vision processor. The radio-frequency (RF) board is manufactured with an asymmetric structure using a hybrid PTFE/FR4 substrate and is equipped with planar antennas.

The radar uses Infineon’s 77GHz SiGe monolithic microwave integrated circuit (MMIC) as its high-frequency transmitter and receiver. The RF dies are packaged in the latest version of eWLB, the fan-out wafer level package developed and manufactured by Infineon. The transmitter and receiver are connected to a dual power amplifier and to a waveform generator from Infineon.

Based on a complete teardown analysis of the Autoliv Multi Mode Radar, the report provides bill-of-material (BOM) and manufacturing cost of the radar sensor and a comparison with the Bosch MRR and Delphi RACam.

A complete physical analysis and a manufacturing cost estimation of Infineon’s MMICs are available in a separate report.

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Overview / Introduction

  • Executive summary
  • Company profile and main features
  • Reverse costing methodology

Physical Analysis

  • Overview of the radar
  • Views and dimensions of the radar
  • Radar teardown
  • Electronic boards
  • MCU board
  • Overview
  • High definition photo
  • Component markings and identification
  • RF board
  • Overview
  • High definition photo
  • Components markings and identification
  • RF chipset analysis
  • Comparison with Bosch MMR1 and Delphi RACam

Cost Analysis

  • RF board cross section and EDX analysis
  • Estimation of the cost of the PCBs
  • BOM cost – MCU board
  • BOM cost – RF board
  • BOM cost – housing
  • Material cost breakdown
  • Accessing the added value (AV) cost
  • MCU board manufacturing flow
  • RF board manufacturing flow
  • Details of the housing assembly and functional test costs
  • Added value cost breakdown
  • Manufacturing cost Breakdown

Estimated Price Analysis

  • Estimation of the manufacturing price
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