IMAGING Infrared

Apple has made a great technology choice with its 3D facial identification for the iPhone X. The new technology is presented as being 20 times more accurate than the older fingerprint approach with a one-in-a million probability of a random person unlocking your iPhone.

The underlying 3D imaging technology is called “Structured light” and uses a set of projected “dots” unto the face of the user. Biometric face authentication allows the screen to be unlocked very fast, and eliminates the need for finger use, entering passwords or patterns.

The IR Dot Projector is the structured light emitter of the 3D camera system called “True Depth” by Apple, that recognises users.

This report is focused on the illumination module which includes 4 innovative sub-parts:

• Its packaging exploits a novel thermal management approach with ceramic substrate inserted
• Its NIR vertical cavity surface emitting laser (VCSEL) diode with a dedicated light emission profile driven by a Broadcom integrated circuit
• A folded optical path using wafer level optic
• Its active diffractive optical element (DOE)

The report provides a complete process reverse engineering of the complex module with a detailed analysis of the supply chain.

This report describes the full system’s technology and manufacturing process, including the package, VCSEL, electronics, the folded optic and the DOE. It estimates the manufacturing cost and price for the Dot Projector and compares it with other 3D sensors, such as Intel’s Real Sense, and the sensor pmd provides Lenovo.

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Overview / Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile

• Heptagon
• Apple 3D Tri-Camera System
• Apple iPhone X Teardown

Physical Analysis

• Overview of the Physical Analysis
• Physical Analysis Methodology
• Dot Projector
  • Dot projector views and dimensions
  • Dot projector disassembly: Lenses, active DOE, NIR VCSEL, package
• Package
  • View, dimensions and marking
  • Cross-section
  • Process characteristics
• NIR VCSEL
  • Die view, dimensions and marking
  • Wire bonding and cavity
  • Cross-section
  • Process characteristics
• Folded Optic
  • View, dimensions and marking
  • Disassembly and main block identification
  • Lens cross-section
• Active DOE
  • DOE dimensions, disassembly and main block identification, cross-section
• Comparison: Apple Dot Projector, Intel Real Sense, pmd/Infineon

Manufacturing Process Flow

• Global Overview of the Dot Projector
• NIR VCSEL Front-End Process
• NIR VCSEL Wafer Fabrication Unit
• Folded Optic Wafer Process Flow
• Folded Optic Wafer Fabrication Unit
• DOE Wafer Process Flow
• DOE Wafer Fabrication Unit
• Package Process Assembly Unit

Cost analysis

• Overview of the Cost Analysis
• Yields Explanation and Hypotheses
• Integrated Circuit Cost
• NIR VCSEL Cost
• Folded Optic Cost
• DOE Active Cost
• Package Assembly & Test Cost
• Dot Projector Cost

Estimated Price Analysis

Company Services

• ams’ Direct Time-of-Flight Detection SPAD-Based Proximity Sensor
• Status of the Camera Module Industry 2019 – Focus on Wafer Level Optics
• VCSELs – Technology, Industry and Market Trends 2018
• Status of the CMOS Image Sensor Industry 2018
• Sony’s 3D Time-of-Flight Depth Sensing Camera Module
• Valeo SCALA Laser Scanner
• Wafer to Wafer Permanent Bonding Comparison 2018
• Xiaomi Mi 8 Explorer Teardown and Identification of Key Components
• Apple vs. Samsung: Ambient Light and Proximity Sensing Devices Comparison
• ams’ Spectral Sensor Portfolio: the AS726X Series