MEMS IMU/Combo

High precision 6-Axis Inertial Measurement Unit for industrial and harsh environments.

To develop robots, smart agriculture and drones, accurate motion capture sensors are central to success. The requirements for high precision, long mission life and high reliability are not provided by standard consumer solutions. Analog Devices has developed the ADIS16460 for these applications, which they call the Internet of Moving Things.

The ADIS16460 is a 22.4mm × 24.2mm × 9mm module targeted for applications such as platform control, navigation, robotics, and medical instrumentation. Mixing technologies developed for military use and harsh environments, the ADIS16460 is a 6-axis Inertial Measurement Unit (IMU) with ±100°/sec digital gyroscope sensing and a 5g accelerometer. It uses low-cost MEMS technology based on Analog Devices iMEMS® process, with a new cap sealing technology used for the gyroscope MEMS.

In order to produce a small and economical module, Analog Devices uses a very smart design and assembly process. This design allows ADI to reuse components from its portfolio and thus to optimize manufacturing cost.

The report contains a detailed physical analysis with process descriptions and manufacturing cost analysis. It also includes a full comparison between Sensonor’s STIM210 and the ADIS16136.

                            

Overview/Introduction

• Executive Summary
• Reverse Costing Methodology

Company Profile

• Analog Devices ADIS16460 6-axis IMU
• Supply Chain
• Market Research

Physical Analysis 

• Views and Dimensions of the System
• System Opening
• 3D Sensing
• IMU Board
• ADXL203
  • Package
  • Die Dimension
  • Accelerometer
  • Transistor
  • CMOS/MEMS Process
• ADXR290
  • Package
  • ASIC Die
  • MEMS Die
  • MEMS Cross-Section
  • MEMS Process
• Electronic Board Manufacturing Flow
• Comparison Sensonor STIM210 and ADI ADIS16163

Sensor Manufacturing Process

• ADXL203
• ADXR290
• ADIS16460

Cost Analysis

• Accessing the BOM
• ADXL203
  • Wafer Cost
  • Package Cost
  • Component Cost
• ADXR290
  • ASIC Wafer Cost
  • ASIC Die Cost
  • MEMS Wafer Cost
  • MEMS Process Step Cost
  • MEMS Die cost
  • Package Cost
  • Component Cost
• BOM Cost
• Material Cost Breakdown by Component Category
• Accessing the Added Value (AV) cost
• Details of the Electronic Board AV Cost
• Details of the Housing AV Cost
• Manufacturing Cost Breakdown for 100k units

Selling Price

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