IC & RF RF IC

Deep insight into the high performance RF MEMS switch dedicated to industrial applications.

The radio-frequency (RF) MEMS market has two segments. The major part is related to filters, with big company players like Broadcom, Skyworks or Qorvo relying on acoustic wave devices. The second part is expected to take off in 2019 and is related to switches. In this area, small companies like Cavendish Kinetics are already supplying the consumer market in small volumes and only for low end smartphones. But this year, some players are entering in this field with devices targeting mainly industrial applications. These components from Menlo Micro, Air MEMS, Analog Devices Inc. (ADI) are expected to enter mass production and be integrated in devices. These switches are expected to replace electromechanical relays (EMR) in instrumentation or test systems that are currently looking for high speed, low loss switching.

ADI is the first to propose two versions of its RF MEMS switch technology in the mass market, the ADGM1304 and the 1004. The first is a RF MEMS switch with an integrated circuit (IC) companion to drive the signal to the MEMS die. The second is a similar version of the device with a driver IC and MEMS die, but also integrates an ElectroStatic Discharge (ESD) system.

For several years, ADI has anticipated the need for MEMS switches. The devices rely on an ohmic structure and can process up to four RF signals through one output, in Single Pole Quad-Throw (SP4T) configuration. Based on a silicon substrate, this technology allows the company to make a device smaller and faster than EMR devices with a remarkable lifetime, making it more reliable. Doing so, all the MEMS innovation makes the devices more suitable for test equipment, wireless networks and satellites. Its small form factor makes it faster in switching operation and consumes less power.

The report will include a detailed physical description of the Analog Devices ADGM1304 along with a cost analysis. Also, the report includes a physical and cost comparison with the ADGM1001 providing the resemblances and the differences between both devices.

 

Overview/Introduction

Analog Devices Company Profile

Market Analysis

Physical Analysis

• Physical Analysis Methodology
• Package Analysis
  • Package view and dimensions
  • Package X-ray view
  • Package opening and cross-section
• Dies Analysis
  • MEMS die view and dimensions
  • MEMS die opening
  • MEMS die cross-section
  • ASIC die view and dimensions
  • ASIC delayering and main blocks IDs
  • ASIC die process

Manufacturing Process Flow

• ASIC Front-End Process
• ASIC Front-End Fabrication Unit
• MEMS Process Flow
• MEMS Fabrication Unit
• Back-End Process and Assembly Unit

Cost Analysis

• Overview of the Cost Analysis
• Supply Chain Description
• Yield Hypotheses
• ASIC Cost Analysis
  • Wafer front-end cost
  • Die cost
• MEMS Cost Analysis
  • Wafer front-end cost
  • Wafer front-end cost by step
  • Die cost
• Package Cost Analysis
• Component Cost

Estimated Price Analysis

Comparison with ADGM1004

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