Follow us :

Computing And Software

AMD Ryzen 5 Pro SoC Central Processing Unit - Package Cross-Section - System Plus Consulting

AMD Ryzen 5 Pro SoC Central Processing Unit

Published
13/10/2021
Product code
SPR21637
Price
EUR 6,490
Applications
Mobile & Consumer
Sample Flyer Ask for info

System-on-chip mobile processor using TSMC’s 7nm process technology with multiple layers of MIM capacitor material embedded between the die metal layers.

AMD Ryzen 5 Pro SoC Central Processing Unit - Package Cross-Section - System Plus Consulting

The recent transition to working and learning from home has driven resurgent growth in the laptop CPU market, with 1H21 generating 62% more revenue for CPU designers than 1H19.  With solutions like the Ryzen 5, AMD has increased their laptop CPU revenue by almost 2.5x over the same period, raising their revenue share to 12% in Q2-2021.    Advanced Micro Devices (AMD) has introduced several system-on-chip circuits using 7nm to target business and commercial products. AMD’s Ryzen PRO processors are multi-core processors with high performance, enhanced battery life, and several security features.

AMD’s Ryzen 5 Pro 5650U processor uses a 6-core processor, where multiple cores maximize performance for professional and business applications. It is designed with layered security features to protect its users from any data breach. Laptops powered by the Ryzen 5 Pro processor benefit from an enhanced, uncompromised battery life that allows users to operate longer hours without being on the power source.

AMD’s processor is built on a 7nm FinFET process designed to boost power efficiency in laptops and provide ultimate processing speeds. The 7nm technology and optimized architecture design enable consumers to reap the benefit of high computing performance in a light design.

This report constitutes an exhaustive analysis of the AMD Ryzen 5PRO 5650U system-on-chip processor, including a full analysis of the package and SoC die. Also provided are a complete teardown and physical analysis including 3D x-ray images as well as optical and SEM pictures of the package cross-section and the die cross-section. The die cross-section reveals several layers of MIM capacitors embedded between the die metal layers. EDX analysis allowing for material identification was undertaken to reveal the materials used in the manufacturing process. This report also includes a floorplan analysis that discloses the high-level chip architecture and an estimation of IP block area. High-resolution SEM images expose the 7nm process technology.

Additionally, a section is included which details the manufacturing process of the processor. Lastly, the cost analysis includes an estimation of the wafer cost, die cost, packaging, and component cost of the Ryzen R5 PRO 5650U processor.

AMD Ryzen 5 Pro SoC Central Processing Unit - Die Cross-Section with MIM Capacitors Embedded between Metal Layers - System Plus Consulting AMD Ryzen 5 Pro SoC Central Processing Unit - Processor Die - System Plus Consulting AMD Ryzen 5 Pro SoC Central Processing Unit - Processor Copper Pillar - System Plus Consulting
Back to top

Overview / Introduction

Technology and Market

Company Profile

Physical Analysis

  • IPD Analysis
    • NXP ESD Filter Die Analysis
  • Die Views and Dimensions
  • Die Cross-Section
  • Die Process Characteristics
  • Qualcomm n77/n78/79 Filter Die Analysis
  • NXP ESD Filter Die Analysis
  • STMicroelectronics ESD Filter Die Analysis
  • STMicroelectronics 2.4 GHz Wi-Fi Balun Die Analysis
  • Mediatek Wi-Fi/BT Balun Die Analysis
  • Qorvo B46 Diplexer/Coupler Die Analysis
  • Atheros Wi-Fi Dual Band Balun Die Analysis
  • SiGe Wi-Fi Dual Band Balun Die Analysis
  • Silicon Capacitor Analysis
    • Deep Trench Capacitors
  • Murata
    • Die Views and Dimensions
    • Die Delayering
    • Die Cross-Section
  • TSMC
  • Planar Capacitor
  • Die Views and Dimensions
  • Die Cross-Section
  • Microchip
  • Macom
  • Skyworks
  • Vishay

Technology and Physical Comparison

  • IPDs
  • Si Capacitors

Manufacturing Process Flow

  • IPDs – Wafer Fabrication Unit and Process
  • Silicon Capacitors – Wafer Fabrication Unit and Process

Cost Analysis

  • Yields Explanation & Hypotheses
  • IPD Cost Analysis
  • Main Steps of the Economic Analysis
  • Wafer and die Cost
  • Silicon Capacitor Cost Analysis

Cost Comparison

  • IPDs
  • Silicon Capacitors

Feedback                                                           

SystemPlus Consulting Services

Back to top
© Copyright 2021 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions