PACKAGING SIP

The impending fifth generation (5G) commu-nication technology is bringing a new order to the market. Major companies are battling to provide devices that could be integrated into the resulting smartphones. And even though not all technologies suit 5G requirements, every player could win something in the battle. Packaging could be a major domain where performance, integration and cost efficiency will be optimized to provide the most suitable device. All high-quality competitors are looking for a better way to make high-density front-end communication devices. With this historic advance, it is the perfect time to examine every module supplier and, compare their integration technologies and costs.

To accompany Yole Développement’s Advanced RF SiP for Cell Phones 2017 Market and Technology Report, System Plus Consulting has conducted a comparative technology review. It provides insights into structure, technology and costing for RF SiP packaging of front-end modules (FEMs) in smartphones. The report includes the study of eight FEMs found in three high-end flagship smartphones, the Huawei P10, the Samsung Galaxy S8 and the Apple iPhone 8 Plus. In these phones, five major suppliers, Skyworks Solutions, Murata, TDK-Epcos, Qorvo and Broadcom, share the market.

After a teardown of these three high-end smartphones, we extract the main RF modules and analyze them in detail. We study their sizes and technologies, describe the technical and economic choices made by the original equipment manufacturers (OEMs) that produce the phones and an overview of the packaging market. We have analyzed the major players, who remain Broadcom/Avago, Qorvo, Skyworks Solutions, Murata and Epcos/TDK.

The report includes a description of each component and important data, including type of substrate, proportion of silicon in the module and line spacing. We also include comparisons for all front-end modules analyzed and a manufacturing cost estimation of the SiPs. Wifi and Bluetooth modules are not covered in this report.

        

Bundle offer available with the MEMS Packaging – Market and Technology Trends 2017
at EUR 8 890, contact us!

Overview / Introduction

Company Profiles

• Skyworks Solutions
• Murata
• TDK-Epcos
• Qorvo
• Broadcom

Smartphone Teardowns

• Apple iPhone 8 Plus
• Samsung Galaxy S8
• Huawei P10

Physical Analysis

• Front-End Modules
  • Package views and dimensions
  • Package opening
  • Component distribution
  • Package cross-sections:

• Substrate dimensions and analyses
• Metal lids
• Chip bonding
• Technology summary
  • Package Technology Comparison

Manufacturing Process Flow

• Packaging Fabrication Unit
• RF SiP Package Process Flow

Cost Analysis

• Overview of the Cost Analysis
• Supply Chain Description
• Yield Hypotheses
• Die Cost Estimation
• RF SiP Package Cost Analysis
  • RF SiP front-end cost
  • RF SiP cost by process step
• Final Test Cost
• Supply Chain Description

Estimated Price Analysis

Package Cost Comparison

• Status of the MEMS Industry 2018
• RF Integrated Passive Devices: Reverse Costing Overview
• Smartphone RF Front-End Module Review
• 5G’s Impact on RF Front-End Module and Connectivity for Cell Phones 2018
• Peraso X710 Chipset 60GHz Outdoor Wireless Broadband Solution
• Qualcomm VIVE® QCA9500 High Density WiGig/WiFi 802.11ad Chipset for the 60 GHz Band
• MEMS Packaging: Reverse Technology Review
• RF Front End Modules and Components for Cellphones
• Samsung Exynos 9110 with ePLP: First Generation of Samsung’s Fan-Out Panel Level Packaging (FO-PLP)
• Qualcomm 60GHz WiGig/WiFi 802.11ad Chipset World’s First Smartphone Edition