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SP20571-ToF module tilted view

3D Time-of-Flight Module in Meizu 17 Pro

Product code
EUR 3 990
Mobile & Consumer
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The first 3D ToF camera from Samsung with Lumentum’s VCSEL.

SP20571-ToF module cross-section schematic

The consumer 3D sensing module market is expected to reach $8.1B in 2025, up from $2B in 2019, according to the “3D Imaging & Sensing 2020” report from Yole Développement. In this context, Samsung has entered the Time of Flight (ToF) sensing market by introducing its first near infra-red (NIR) camera found in the Meizu 17 pro’s ToF module.

This full reverse costing study has been conducted to provide insights into technology data, the manufacturing cost and selling price of the rear ToF module in the Meizu 17 pro.

The 3D sensing module is packaged in one metal enclosure and includes a new Back-side Illumination (BSI) NIR CMOS Image Sensor (CIS) from Samsung. The sensor features 7 µm pixels and a resolution of 0.3 Mpixels. The ToF uses a vertical cavity surface emitting laser (VCSEL) coming from Lumentum.

A wafer level chip scale packaging (WLCSP) driver integrated circuit from PhotonIC generates the pulse and drives the VCSEL’s power and beam shape.

Along with the complete technical analysis of the 3D depth sensing system, this report analyses the cost and estimates the price for the system. It also includes a technical and cost comparison with the rear 3D sensing system in the Galaxy Note 10+ and the iPad pro.

SP20571-ToF module tilted view SP20571-NIR ToF sensor SP20571-Flood illuminator tilted view
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  • Executive Summary
  • Reverse Costing Methodology

Company Profile

Market Analysis

Physical Analysis

  • Summary of the Physical Analysis
  • 3D Sensing System Assembly
    • Module views, opening and cross-section
  • NIR Camera Module
    • Module view, dimensions and cross-section
  • NIR CMOS Image Sensor
    • Die overview, dimensions, process and cross-section
    • Die process characteristics
  • Flood Illuminator
    • Module view, dimensions and cross-section
    • Die overview, dimensions, process and cross-section
    • Die process characteristics
  • VCSEL Driver Die
    • Die view, dimensions, delayering and main blocks
    • Die process characteristics

Manufacturing Process Flow

  • Overview
  • NIR Sensor Die Front-End Process and Fabrication Unit
  • NIR VCSEL Process Flow and Fabrication Unit
  • VCSEL Driver Die Front-End Process and Fabrication Unit

Cost Analysis

  • Summary of the Cost Analysis
  • Yield Explanations and Hypotheses
  • NIR Camera Module
    • Pixel array, BSI and optical Front-End cost
    • NIR ToF image sensor wafer and die cost
  • Flood Illuminator Module
    • NIR VCSEL Front-End cost, probe test, Thinning and dicing
    • NIR VCSEL die wafer cost
    • Component cost
  • VCSEL Driver
    • Front-End cost, probe test and thinning and dicing
    • Die cost
  • ToF Module
    • Complete module cost and price

Technical and Cost Comparison

  • Meizu 17pro vs. Galaxy Note10+ vs iPad pro
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