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MEMS Gyroscope

2-Axis Gyroscopes for Optical Image Stabilization

Product code
EUR 5 500
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2-Axis Gyroscopes for Optical Image Stabilization (OIS) constitute a market where 123 million units were shipped in 2015, according to Yole Développement. This market originates only from high-end smartphones and two players share most of it: InvenSense, with 49%, and STMicroelectronics, with 39%.

The 2-axis gyroscopes are located inside the camera module of high-end smartphones. The main constraints are a small footprint and, more importantly, thinness.

Previously, thickness was the same as standard land grid array (LGA) or quad flat no-leads (QFN) package, close to 1mm. Now the standard is 0.65mm, which products from both InvenSense and STMicroelectronics attain.

InvenSense was first, with the IDG-2030, a 2.3×2.3×0.65mm gyroscope, which is still the smallest on the market. Since its introduction we found it in several smartphones from various manufacturers. The IDG-2030 uses the same Nasiri platform as other InvenSense inertial devices, with wafer-level integration of the MEMS sensor on top of the application specific integrated circuit (ASIC), thus providing only one die in the final LGA package.

Months later, STMicroelectronics released the L2G2IS, which shares the same dimensions. The device is manufactured using the same THELMA process as all STMicroelectronics inertial devices. The THELMA platform involves a two-die approach that is challenging for very thin package integration. However, both players now offer very low-cost gyros thanks to die size reduction and process optimization.

Both gyroscopes analyzed are 2-axis X, Y (Pitch, Roll). The two reports can be purchased separately or together in order to compare the technology and pricing of the main smartphone OIS gyro players, including previous generation products.


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Overview / Introduction

Company Profile & Supply Chain

Physical Analysis

  • Package
    • Package views and dimensions
    • Package opening
    • Package cross-section
  • ASIC Die
    • View, dimensions, and marking
    • Delayering and proces
    • Cross-section
  • MEMS Die
    • View, dimensions, and marking
    • Cap Removed
    • Sensing Area
    • Cross-sections (Sensor, Cap, Sealing)

Manufacturing Process Flow

  • ASIC front-end process
  • ASIC wafer fabrication unit
  • MEMS process flow
  • MEMS wafer fabrication unit
  • Packaging process flow
  • Package assembly unit

Cost Analysis 

  • Yields hypotheses
  • ASIC front-end cost
  • ASIC back-end 0: probe test and dicing
  • ASIC wafer and die cost
  • MEMS front-end cost
  • MEMS back-end 0: probe test and dicing
  • MEMS front-end cost per process steps
  • MEMS wafer and die cost
  • Back-end: packaging cost
  • Back-end: packaging cost per process steps
  • Back-end: final test cost
  • Gyroscope component cost

Estimated Selling Price

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