Power module packaging market will grow to around US$3.5 billion by 2026
Extracted from :
- Status of the Power Module Packaging Industry, Yole Développement
- Vitesco Technologies Power Module in Jaguar I-PACE Inverter, System Plus Consulting
- Power Electronics for E-Mobility, Yole Développement
“In 2020, motor drives represented the most significant power module market with a value of US$1.6 billion,” announced Shalu Agarwal, Ph.D., Power Electronics & Materials Analyst at Yole Développement (Yole). “However, by 2026, EV/HEVs will become the most significant power module market, representing a market value of almost US$3.6 billion. In addition, the power module packaging raw materials market is growing and will reach an impressive US$3.5 billion by 2026.”
This market’s promising outlook is beneficial for the power module packaging business, which Yole covers in a new dedicated report: Status of the Power Module Packaging Industry.
This report is one of an impressive collection of power electronics & compound semiconductor reports and monitors offered by Yole. At the beginning of the year, the market research and strategy consulting company already released its annual EV/HEV report, Power Electronics for E-Mobility, presenting the latest technology trends and market evolution in this domain.
Yole also works closely with System Plus Consultingto get an in-depth understanding of the technologies selected by the leading semiconductor companies. For example, System Plus Consulting developed a dedicated reverse engineering and costing report focused on Vitesco Technologies’ power module for the Jaguar I-PACE inverter. This analysis is available today in a dedicated report: Vitesco Technologies Power Module in Jaguar I-PACE Inverter.
Amine Allouche, Technology & Cost Analyst, Power Electronics at System Plus Consulting, explains: “Power module design, and especially the packaging approach, are at the heart of power electronics innovations. The aim of the leading semiconductor companies is to enhance performance. Today, we find significant innovation in all power module structures, from the baseplate and substrate assembly down to the die attach, through the electrical connection. In Vitesco Technologies’ solution, the module is based on an innovative chip assembly process, including double-sided sintering. To enhance electrical performance, clip connections and substrates are optimized for silver sintering. Moreover, the baseplate is designed specifically for strict automotive performance requirements.”
Today, analysts continue their investigation and delve deeper into the power electronics technologies to reveal the latest innovations at the power electronics module level. The Status of the Power Module Packaging Industry
In this dynamic field, the market research and strategy consulting company, Yole, releases today its annual analysis: Status of the Power Module Packaging Industry reportalso provides a focus on SiC & GaN power devices and their packaging technologies. It reveals insights into power module substrates, technology trends, and the supply chain. It details the power module packaging requirements for various applications and delivers a special focus on the Chinese market. 800V batteries and their impact on the power module packaging market are also well described in this new report.
Yole and System Plus Consulting work together daily to follow the power electronics industry, in which packaging and power modules play a key role. In addition to the China – US trade war, the COVID-19 pandemic, and the current semiconductor shortage, companies face numerous business issues and technical challenges. In this dynamic context, analysts today offer you a snapshot of this industry.
Throughout the year, System Plus Consulting and Yole Développement publish an impressive collection of power electronics-dedicated reports and monitors.
Make sure to be aware of the latest news coming from the industry and get an overview of our activities on i-Micronews. Stay tuned!
- Power SiC: Materials, Devices and Applications 2020
- Compound Semiconductor Quarterly Market Monitor, Q3 2021
- Silicon IGBT Comparison 2021
- Hitachi Double-Side Cooling Power Module from Audi e-tron’s Inverter
Acronyms :
CAGR: compound annual growth rate
OEM: Original Equipment Manufacturer
EV/HEV: Electric and Hybrid Electric Vehicle
SiC : Silicon Carbide
GaN : Gallium Nitride