Follow us :


System-in-Package industry: IDMs, OSATs, and foundries are taking the advantage

“SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the Semiconductor, Memory & Computing division at Yole Développement (Yole)

Read more

Optical Transceivers & Silicon Photonics Forum 2021

Optical Transceiver Silicon Photonics 2021 Yole CIOE_2000x526

September 2 2021, 9AM – 1PM CEST – Shenzhen, China The trends driving optical transceiver...

Read more

Imaging & LiDAR for Automotive Forum 2021

Imaging & LiDAR 2021_CIOE_2000x526

September 1 2021, 2PM – 6PM CEST – Shenzhen, China Automated driving is coming, and...

Read more

3D Sensing for Consumer Forum 2021

3D Sensing 2021_CIOE_2000x526

September 2 2021, 2PM – 6PM CEST – Shenzhen, China Technology continues to empower the...

Read more

Auto Radar Tech 2021

Romain Fraux, CEO at System Plus Consulting will make a presentaiton at the Third Auto...

Read more
© Copyright 2022 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions