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System-in-Package industry: IDMs, OSATs, and foundries are taking the advantage

“SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the Semiconductor, Memory & Computing division at Yole Développement (Yole)

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Optical Transceivers & Silicon Photonics Forum 2021

Optical Transceiver Silicon Photonics 2021 Yole CIOE_2000x526

September 2 2021, 9AM – 1PM CEST – Shenzhen, China The trends driving optical transceiver...

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Imaging & LiDAR for Automotive Forum 2021

Imaging & LiDAR 2021_CIOE_2000x526

September 1 2021, 2PM – 6PM CEST – Shenzhen, China Automated driving is coming, and...

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3D Sensing for Consumer Forum 2021

3D Sensing 2021_CIOE_2000x526

September 2 2021, 2PM – 6PM CEST – Shenzhen, China Technology continues to empower the...

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Auto Radar Tech 2021

Romain Fraux, CEO at System Plus Consulting will make a presentaiton at the Third Auto...

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