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Smartphone Design Win Quarterly Monitor

Published: 30/09/2021 – Quarter 3
Product code: SPM21003
Application: Consumer


  • PDF with graphs and analyses
  • Web-based dynamic dashboard
  • Direct access to the Analyst
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The first-ever smartphone technology monitor covering the latest components, packaging, and silicon chip choices of smartphone makers.

This smartphone monitor utilizes data from representative phones (65+ phones per year torn down in the System Plus Consulting Phone Teardown Track Module) and follows the OEM market share, which means that the selected phones are a good representation of the market. Also provided is the detailed design wins and related supply chain for the eight phones being analyzed, along with supply chain alternatives for the main devices.

For each device and module, you get access to the technology choices of the manufacturers.

This monitor offers a clear view of the market-leading semiconductor companies and a direct comparison between OEMs.

This includes:

  • Design wins for the top smartphones’ OEM (per Mfr., nationality, type of device…)
  • Packaging evolution in terms of type, footprint, pitch…
  • Die area evolution per function, technology node, wafer size…
  • Focus per category (processor, camera, memory, sensor…)

During a full year you will receive an updated Technology Monitor on a quarterly basis.

Q1 2020 shows Qualcomm leading in design wins (17% of total design wins) and package footprint consumption (21%). Snapdragon processors and RF components (transceivers, RFFEM) explain this.

Regarding die area consumption, Samsung leads (30% of total die area) thanks to memories and image sensors.

BGA and LGA packages are the main packaging platform, with 37% of package footprint consumption.

U.S.-based companies account for 47% of IC design wins and 43% of total die area (Qualcomm, Qorvo, Skyworks, Texas Instruments and Cirrus Logic have the majority). Even though Korea represents only 6% of the IC design wins number, it represents 33% in terms of the total die area. Memory players Samsung and SK Hynix drive this result.
300mm (12-inch) wafer represents 69% of total die area used in Q1 2021, with leading-edge technology nodes (14nm down to 5nm) representing 30% of the total die area. According to Q1 2021 smartphone shipments, 300M wafers account for 5M units shipped for the 8 systems under analysis.

Smartphones analyzed:

The monitor takes into account 32 smartphones from Q1 2021 to Q3 2020:



Executive Summary

Design Wins

  • Design Wins per Vendor
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)
  • Design Wins per Country
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)


  • Package Footprint per Vendors
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)
  • Package Footprint per Category
  • Package Footprint per Family
  • Package Footprint: OEM Evolution (Apple, Samsung, Huawei)

eBoM Cost

  • eBoM Cost per Category
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)

Die, Wafer & Technology

  • Die Area per Vendor
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)
  • Die Area per Country
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)
  • Die Area per Category
    • Smartphone details, OEM evolution (Apple, Samsung, Huawei)
  • Wafer Size Repartition
  • Wafer Material Repartition
  • Technology Node Repartition

Focus on Application Processors

  • Focus on Application Processors
  • OEM Evolution

Focus on Memory

  • Focus on NAND
  • Focus on DRAM
  • OEM Evolution

Focus on Sensors

  • Focus on Sensors: CMOS Image Sensors
  • Focus on Sensors: Others
  • OEM Evolution

Focus on RF

  • Focus on RF
  • OEM Evolution

Focus on Passives

  • Focus on Capacitors
  • Focus on Resistors
  • Focus on Inductors



Teardown Tracks


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