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IWLPC – International Wafer-Level Packaging Conference 2018

System Plus Consulting at International Wafer-Level Packaging Conference 2018?

Dr. Stéphane Elisabeth, Project Manager at System Plus Consulting, will participate to this conference.

You are welcome to take this occasion to meet him and System Plus Consulting’s team on booth 45, and:

  • Understand our cost methodology
  • Discuss about our costing tools (software)
  • Discover our last Reverse Costing reports
  • Get a full demo a one of our catalogue report

Where? in San Jose, CA, USA

When? October 23rd – 25th, 2018

Why coming to International Wafer-Level Packaging Conference 2018?

SMTA and Chip Scale Review are pleased to announce the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry’s most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

 

Find more information on the event here.

– By IWLPC 2018 –

 

If you want to know more, contact us to schedule a meeting: info@systemplus.fr.

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