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International Wafer-Level Packaging Conference – IWLPC

International Wafer-Level Packaging Conference – IWLPC – 2019

System Plus Consulting at IWLPC

Stéphane Elisabeth, Expert Cost Analyst at System Plus Consulting, will participate to this conference; feel free to meet them onsite on booth 17, co-located with Yole Développement.

You are welcome to take this occasion to meet them and:

  • Understand our cost methodology
  • Discuss about our costing tools (software)
  • Discover our lastest Reverse Costing reports
  • Get a full demo a one of our catalogue report

San Jose, CA, USA

When? October 22 to 24, 2019

Why coming to IWLPC

Interconnecting Wafer-Level Packaging, 3D Packaging, Advanced Manufacturing and Test, the International Wafer-Level Packaging Conference (IWLPC) is at the forefront of the packaging technology evolution.

The Wafer-Level Packaging (WLP) track features sessions on Advanced Wafer Level Packaging & Materials, Reliability and Metrology, Fan Out Wafer level Packaging (FO-WLP), and Advanced Processing.

The 3D Packaging track features sessions on Design, Characterization and Test, Wafer Bonding and Chip Stacking, and Processing for Fan-Out.

The Advanced Manufacturing track features sessions on Process Materials and Equipment.

Find more information on the event here.

– By IWLPC –


If you want to know more, contact us to schedule a meeting:

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