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System Plus Consulting reveals the Samsung Galaxy S7’s audio codec secrets

Press Release System Plus Consulting reveals the Samsung Galaxy S7’s audio codec secrets
by Yole Développement, April 28, 2016.

You can read the article here

Fan-Out Wafer-Level Package (FOWLP) is currently the fastest-growing advanced packaging technology, and it will continue growing, towards a $2.4B market by 2020. In this context, more and more fan-out packages will be included in mobile and wireless applications – which remain the main drivers for this package type. (Yole Développement’s report, « Fan-Out WLP: Technology Trends and Business Update 2016 », will be released within the next few months).

System Plus Consulting recently performed a Reverse Costing® on a high-volume FOWLP component found during the teardown of the Samsung Galaxy S7, Qualcomm WCD9335 Fan-Out WLP Audio Codec report. The component, the audio codec, is only present inside some versions of the Samsung Galaxy S7 and S7 Edge. Yole Développement interviewed Romain Fraux, MEMS & Advanced Packaging Project Manager at System Plus Consulting, for more details…

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