Suivez-nous :

fren

SiP trends in automotive – System Plus Consulting interview


The automotive market grew by 7% in revenue in 2017, while semiconductor technology in the automotive market grew by 20%. Electronic devices are more and more common in cars and the number of electronic systems is also increasing… System in Package will be therefore a platform of choice driving more integration and lower cost.

 

We present for you an interview with Romain Fraux, CEO of System Plus Consulting. Romain will present an overview of the SiP trends in automotive at the iMAPS ADVANCED SYSTEM IN PACKAGE (SiP) TECHNOLOGY 2019 in Monterey, from June 25 to 27.

 

What are some of the current trends and growth areas for SiP?
Romain Fraux: Two types of roadmaps have emerged for advanced packaging: scaling, which is going to sub10 nm nodes, and functional, staying above 20nm nodes. The semiconductor industry is developing products on both of them.
Advanced semiconductor packaging is seen as a way to increase the value of a semiconductor product by adding functionality, maintaining and/or increasing performance while lowering cost.

SiP technology is so key to achieving both roadmaps as both require more multi-die heterogeneous integration and higher levels of package customization.

A variety of multi-die SiP packaging is developing in both high and low end, for consumer, performance and specialized applications. Heterogeneous integration has created many opportunities for both substrate and WLP based SiP.
Key growth areas are mobile, especially with the RF components supporting 5G, high performance computing and automotive.

 

 

 

In what applications are SiP devices typically used?
RF: SiP uses both traditional (e.g. wire-bond, lead-frame) and advanced packaging (e.g. WLPs, 3D TSV, flip-chip) platforms. These technologies are also commonly used to integrate logic, memory, MEMS/sensors and ASICs.
Key applications areas:
• Consumer including mobile/tablet/PCs: memory SiP, APU, RF SiP including connectivity (Wi-Fi/Bluetooth), MEMS/sensors SiP (controller IC integrated with mems/sensors), camera module, etc.
• HPC: Logic and memory (e.g. HBM) SiP, logic and logic (e.g. die partitioning) etc.…
• Automotive: power device SiPs and radar

 

 

 

What are the benefits of SiP over other approaches?
RF: SiP benefits are numerous. They have the ability to bring together many ICs and package assemblies and test technologies to create highly integrated products with optimized cost, size and performance.
They provide more flexibility for system designers, faster time to market, reduced motherboard complexity, higher performance, lower system cost, small-form factor and improved reliability.

 

 

 

About the author:
Romain Fraux is the CEO of System Plus Consulting (part of Yole Group of companies), that focuses on Reverse Costing analysis of electronics, from semiconductor devices to electronic systems.
Supporting industrial companies in their development, Romain and his team offer a complete range of services, costing tools and reports. They deliver in-depth production cost studies and estimate objective selling price of a product, all based on a detailed physical analysis of each component in the System Plus Consulting laboratory.
Romain has been working for System Plus Consulting for more than 12 years and was previously the company’s CTO.
He holds a bachelor’s degree in Electrical Engineering from Heriot-Watt University of Edinburgh, Scotland, a master’s degree in Microelectronics from the University of Nantes, France and a Master of Business Administration.

© Copyright 2019 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions