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MEMS Gyroscope

Tronics GYPRO3300 angular rate sensor, a unique, high-performance MEMS gyroscope z-axis for industrial applications - System Plus Consulting

Tronics GYPRO3300 Angular Rate Sensor

Publié
16/01/2018
Code produit
SP18381
Prix
3 490 EUR
Applications
Industriel
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A unique, high-performance MEMS gyroscope z-axis for industrial applications.

Tronics Microsystems, a leader in high-performance MEMS inertial sensors, recently released a new high-performance MEMS gyroscope specially designed for industrial and other demanding applications: the Tronics GYPRO3300. The GYPRO3300 is a next-generation MEMS angular rate sensor that can determine angle changes in three dimensions for applications such as 3D mapping, robotics, AHRS, and navigation systems. Hermetically sealed in a single CLCC 30-pin package, and with a volume under 850 mm3, the GYPRO3300 can be integrated in many advanced systems.

The GYPRO3300 gyroscope is a unique, high-performance z-axis with a sleek structure that includes MEMS and ASIC in a ceramic package, using Tronics vacuum wafer-level packaging (WLP) technology based on micro-machined, thick single-crystal silicon. Resistant to moisture, dust, and dirt, the GYPRO3300 was designed for high-stress conditions. The MEMS structure is based on a tuning-fork design working in anti-phase mode to reject external vibration. This structure is coupled with an ASIC specifically designed by Si-Ware for MEMS gyroscopes.

The GYPRO3300 offers a new level of performance, with a bias instability below 1°/h and a vibration rectification of 0.002°/s/g², which is qualified for industrial applications.  Si-Ware’s ASIC embeds OTP memory, a temperature sensor, and a phase-locked loop to manage, compensate, and process data issued from the MEMS. Moreover, the system works in a close-loop architecture that brings key advantages.

This report analyzes the complete component, including the package, MEMS, and ASIC dies developed by Tronics Microsystems-TDK. Moreover, this report provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used.

Also included is a complete cost analysis and selling price estimate for the GYPRO3300 z-axis gyroscope, as well as a comparison with two other high-end MEMS gyroscopes:  Sensonor’s STIM210 Multi-Axis and Analog Devices’ ADIS16136.

Tronics GYPRO3300 angular rate sensor, a unique, high-performance MEMS gyroscope z-axis for industrial applications - System Plus Consulting Tronics GYPRO3300 angular rate sensor, a unique, high-performance MEMS gyroscope z-axis for industrial applications - System Plus Consulting Tronics GYPRO3300 angular rate sensor, a unique, high-performance MEMS gyroscope z-axis for industrial applications - System Plus Consulting
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Overview /Introduction

Tronics Microsystems – Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • Sensor Package
    • View and dimensions
    • Package opening
    • Sensor package cross-section
  • MEMS Die
    • MEMS cap : View and dimensions
    • MEMS sensing area
    • MEMS die cross-section
  • ASIC Die
    • ASIC die view and dimensions
    • ASIC delayering and main blocs
    • ASIC die cross-section

Manufacturing Process Flow

  • ASIC Process Characteristics
  • ASIC Wafer Fabrication Unit
  • MEMS Front-End Process
  • MEMS Wafer Fabrication Unit

Cost Analysis

  • Cost Analysis Overview
  • Main Steps Used in the Economic Analysis
  • Yield Hypotheses
  • MEMS/ASIC Die Cost
    • Front-end (FE) cost
    • Back-end – tests and dicing
    • Wafer and die cost
  • Component
    • Packaging cost
    • Component cost

Estimated Price Analysis

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