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Toshiba TL1F1-LW1 – LED GaN on Silicon

Publié
15/01/2014
Code produit
SP14151
Prix
2 990 EUR
Applications
Extrait disponible Brochure disponible Demande d'info

Toshiba has recently released its first GaN on Silicon LED in a 6450 standard package with several new features.

The TL1F1 LED are produced on a cheap 8” silicon substrate in a standard power silicon facility from Toshiba. The integration in a standard facility has been facilitated by a smart bonding process without gold.

Moreover, a significant work has been done to thin the epitaxial layer in GaN. The thickness of the GaN layer is close to thicknesses measured on Sapphire LED.

A low current density per sq cm is obtained, estimated at 20A/cm², lower than sapphire LED. But the second generation GaN on Si LED produces 30% more lumen.

This report provides a complete teardown of the LED die and the package with:

  • Detailed photos
  • Material analysis
  • Detailed structure of dies and package
  • Manufacturing process flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation
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Glossary

1. Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

 2. Companies Profile

  • Toshiba Profile

 3. TH1L1-LW1 Characteristics

  • TH1L1-LW1 Characteristics

 4. Physical Analysis

  • Physical Analysis Methodology
  • Package Views & Dimensions
  • Package Opening
  • Package X-Ray
  • Package Cross-Section
  • Phosphor
  • Protective diode
  • LED Views & Dimensions
  • Cathode
  • Anode
  • Epitaxy
  • LED Thickness
  • LED Characteristics

5. Manufacturing Process Flow

  • Global Overview
  • LED Fabrication Unit
  • LED Process Flow
  • Package Fabrication Unit
  • Package Process Flow

 6. Cost Analysis

  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • Epitaxy Step
  • LED Epitaxy Cost
  • LED Front-End Cost
  • LED Wafer Cost
  • LED Cost per process steps
  • LED Equipment Cost per Family
  • LED Material Cost per Family
  • Back-End : Probe and cleaving Cost
  • Packaging Cost
  • Packaging Cost
  • Final Assembly Cost
  • Component Cost

7. Price estimation

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