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MEMS Gyroscope

STMicroelectronics – L3G4IS Dual-Core 3-Axis MEMS Gyroscope

Publié
10/04/2013
Code produit
SP13108
Prix
2 490 EUR
Applications
Grand public
Extrait disponible Brochure disponible Demande d'info

While Digital Still Cameras commonly use MEMS based Optical Image Stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.

Instead of using two dedicated sensors, Nokia chose to integrate a single gyroscope for both gesture recognition and camera image stabilization, allowing cost and board space savings.

The L3G4IS is the first two-in-one gyroscope able to sense motion with low noise and high sensitivity for OIS applications and to sense coarse movements with low sensitivity for UI applications.

Assembled in the mainstream LGA 4x4mm package, the L3G4IS integrated in the Nokia Lumia 920 includes a MEMS die manufactured with STMicroelectronics’ THELMA and glass-frit wafer bonding processes. We also had access to a version of the component including a smaller MEMS die featuring a Gold-Gold thermocompression wafer bonding process and a modified THELMA process manufactured with new materials for the buried polysilicon layer used for the electrical interconnections.

This report provides a complete teardown of the MEMS gyro with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

 

 

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Glossary

Overview/Introduction

 STMicroelectronics Company Profile

 Nokia Lumia 920 Teardown

 Physical Analysis

  • Physical Analysis Methodology

Package

  • Package Characteristics & Markings
  • Package Opening – Main Parts
  • Package Opening – PCB Layout
  • Package Cross-Section

ASIC

  • ASIC Dimensions & Markings
  • ASIC Pinout
  • ASIC Cross-Section
  • ASIC Process Characteristics

MEMS

  • MEMS Dimensions & Markings
  • MEMS bonding pads
  • MEMS Cap & Sensing Area
  • MEMS Cross-section
  • MEMS Gold-Gold Bonding Version
  • Shrinked MEMS die
  • Modified THELMA Process

Manufacturing Process Flow

  • ASIC Process Flow
  • Description of the ASIC Wafer Fabrication Unit
  • MEMS Process Overview
  • MEMS Sensor Process Flow
  • MEMS Cap Process Flow
  • MEMS Wafer Bonding Process Flow
  • Description of the MEMS Wafer Fabrication Unit
  • Packaging Process Flow

Cost Analysis

  • Main Steps of Economic Analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
  • ASIC Die Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Die Cost (Front End + Back End 0)
  • Back-End : Packaging Cost
  • Back-End : Final test & Calibration Cost
  • L3G4IS Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

 

 

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