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MEMS Environnement

STMicroelectronics HTS221

Publié
23/04/2015
Code produit
SP15209
Prix
2 990 EUR
Applications
Grand public
Extrait disponible Brochure disponible Demande d'info

The HTS221 humidity sensor is the first environment sensor from STMicroelectronics which follows the train of new open cavity combos. Assembled in a 6-pins LGA 2 x 2 x 0.9mm package; the HTS221 is a digital humidity and temperature sensor equipped with a sensor die and an ASIC. It has operating ranges of -40…+125°C, 0…100 % relative humidity for 16bit output data for temperature and humidity.

The relative humidity sensor uses a polymer dielectric planar capacitor digital measurement technology which allows a precise response in very compact size. The integrated heater allows a high ODR.

This device uses a new type of package built around an original holed cap developed by STMicroelectronics for mobile phones and for industrial application with a temperature range from -40 °C to +120 °C.

The report presents deep technology and cost analysis of HTS221 with an exhaustive package analysis. It also includes a technology and production cost comparison with Bosch BME280 humidity and pressure sensor and with Sensirion SHTC1 humidity MEMS.

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Glossary

Overview/Introduction, Companies Profile

Physical Analysis

  • Package
    • Package Views & Dimensions
    • Package Opening
    • Wire bonding Process
    • Package Cross-Section
  • ASIC Die
    • View, Dimensions & Marking
    • ASIC Delayering
    • ASIC main blocks identification
    • ASIC Process
    • ASIC Die Cross-Section
  • Pressure & Humidity Die
    • View, Dimensions & Marking
    • MEMS Humidity Sensing Area
    • Cap
    • MEMS Humidity Cross-Section
    • MEMS processes

Comparison with Bosch BME280 and Sensirion SCHTC1 pressure sensor

Manufacturing Process Flow

  • ASIC Front-End Process
  • MEMS humidity Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Front-End Cost
  • MEMS HumidityWafer & Die Cost
  • MEMS HumidityFront-End Cost
  • MEMS Humidity Back-End 0 : Probe Test & Dicing
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • BME280 Component Cost

Estimated Price Analysis

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