Suivez-nous :

fren

MEMS Gyroscope

STMicroelectronics A3G4250D Automotive MEMS Gyroscope

Publié
29/10/2014
Code produit
SP14187
Prix
2 990 EUR
Applications
Automobile
Extrait disponible Brochure disponible Demande d'info

MEMS are getting broadly adopted in the automotive industry and non-safety applications like in-dash navigation are now requiring low-cost and small footprint components.

The A3G4250D is a low power consumption MEMS gyroscope which is the first 3-axis gyroscope to have met the industry-standard qualification for automotive integrated circuits (AEC-Q100).

STMicroelectronics 3-axis gyroscope for automotive applications measures angular rates up to ±245 dps and has been designed and produced using the same manufacturing process (THELMA) than ST consumer products.

Assembled in a 4.0 x 4.0 x 1.1mm package, it embeds an 8-bit temperature sensor and operates within an extended temperature range from -40 to 85°C.

It is suitable for applications including in-dash navigation, telematics and vehicle tolling systems, motion control with MMI (man-machine interface), appliances and robotics.

Retour en haut

Glossary

Overview/Introduction , ST Company Profile

Physical Analysis

  • Package

Package Views & Dimensions
Package Opening
Wire Bonding Process
Package Cross-Section

  • ASIC Die

View, Dimensions & Marking
Delayering
Main Blocks Identification
Cross-Section
Process Characteristics

  • MEMS Die

View, Dimensions & Marking
Bond Pad Opening
Cap Removed & Cap Details
Sensing Area Details
Cross-Section (Sensor, Cap & Sealing)
Process Characteristics

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • A3G4250D Component Cost & Price
Retour en haut
© Copyright 2019 SYSTEM PLUS CONSULTING SARL l Tous droits réservés l Legacy Mentions