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MEMS Gyroscope

STMicroelectronics – L3G3250A 3-Axis MEMS Gyroscope

Publié
06/04/2012
Code produit
SP12092
Prix
1 990 EUR
Applications
Grand public
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System Plus Consulting is proud to publish the reverse costing report of the latest 3-axis analog MEMS Gyroscope supplied by STMicroelectronics.

With an LGA package measuring 3.5x3x1mm, the L3G3250A features the smallest footprint of all the 3-axis gyroscopes and succeed to the VTI CMR3000. Compared to the main gyros for consumer applications in production today (4x4mm), the L3G3250A achieves a footprint reduction of nearly 35% and a volume reduction ranging from 27% to 40%.

The L3G3250A is suitable for various applications including Gaming and virtual reality input devices, motion control with MMI (man-machine interface), GPS navigation systems, appliances and robotics.

This report provides complete teardown of the MEMS gyroscope with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

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Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profile

  • STMicroelectronics Profil
  • L3G3250A Characteristics
  • Business Model

 Physical analysis

  • Package Characteristics & Markings
  • Package X-Ray
  • Package Cross-Section
  • Package Opening
  • ASIC – Dimensions
  • ASIC – Markings
  • ASIC – Cross-Section
  • ASIC Process Characteristics
  • MEMS – Dimensions
  • MEMS – Markings
  • MEMS – Bond Pads
  • MEMS – Cap Opening
  • MEMS – Sensing Area
  • MEMS – Cross-section
  • MEMS Process Characteristics
  • Physical Data Summary

Manufacturing Process Flow

  • Overview
  • ASIC Process Flow
  • MEMS Process Flow
  • Description of the Wafer Fabrication Units

 Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Yields Hypotheses
  • Die per wafer & Probe Test
  • ASIC Front-End : Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
  • ASIC Die Cost
  • MEMS Front-End : Hypotheses
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Die Cost (Front End + Back End 0)
  • Back-End 1 : Packaging Cost
  • Back-End 1 : Final test & Calibration Cost
  • L3G3250A Component Cost (FE + BE 0 + BE 1)

 Estimated Price Analysis

 Conclusion

 

 

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