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PUISSANCE SiC

ROHM 1700V SiC MOSFET SCT2H12NZGC11 Discrete

Publié
12/04/2017
Code produit
SP17310
Prix
3 490 EUR
Applications
Industriel
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After more than five years since SiC MOSFETs were first released, they are gradually penetrating different industries for power conversion applications. The market outlook is promising with a compound annual growth rate of 42% from 2015 to 2021. The forecast for 2017 is expected to be even better than previous years with increasingly positive signals from the industry.

Against this backdrop, Rohm offers a series of new SiC products at different voltages. It appears that it uses trench structures for 650V and 1200V products, while 1700V products use planar structures.

The SCT2H12NZGC11 is a 1700V SiC MOSFET from Rohm for industrial and commercial power application such as power supplies.  The device offers a quite low on-resistance but very high current density and integrates the second generation high-voltage SiC power MOSFET dies, which now achieve 3.7A current.

Thanks to the die design the device’s cost is very competitive. The gate structure is very simple and the packaging is optimized to save costs.

The report presents a deep technology analysis of the packaging and components with images of the planar SiC structure.

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Overview / Introduction

  • Executive summary
  • Reverse costing methodology

Company Profile

  • Rohm Semiconductor

Physical Analysis

  • Synthesis of the physical analysis
  • Package analysis
    • Package opening
    • Package cross-section
  • MOSFET die
    • MOSFET die view and dimensions
    • MOSFET die process
    • MOSFET die cross-section
    • MOSFET die process characteristic

MOSFET Manufacturing Process

  • MOSFET Die Front-End Process
  • MOSFET Die Fabrication Unit
  • Final Test and Packaging Fabrication unit

Cost Analysis

  • Synthesis of the cost analysis
  • Yield explanations and hypotheses
  • MOSFET die
    • MOSFET front-end cost
    • MOSFET probe test, thinning and dicing
    • MOSFET wafer cost
    • MOSFET die cost
    • Wafer cost evolution
    • Die cost evolution
  • Complete MOSFET
    • Assembled components cost
    • Synthesis of the assembling
    • Component cost

Price Analysis

  • Estimation of selling price

Company Services

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