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MEMS Empreinte

NEXT Biometrics NB-1010-U/NB-2020-U

Publié
17/05/2016
Code produit
SP16271
Prix
3 290 EUR
Applications
Grand public
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This reverse costing study provides insight into technological data, manufacturing cost, and selling price of the NEXT Biometrics NB-1010-U and NB-2020-U Fingerprint Sensor Assembly.

The same fingerprint sensor die was found in two different products: a DELL Laptop and the NEXT Biometrics Oyster, an access-control peripheral. Supported by PCB, the fingerprint sensor’s dimensions are 25.2 x 19.0 mm, it is driven by a NEXT Biometrics ASIC, and it is protected by a metal cover. The sensor has a resolution of 46,080 pixels, with a pixel density of 385ppi, and it uses the NEXT Active Thermal™ sensing principle to take an image of the fingerprint.

The sensor die is manufactured on glass with LTPS technology and uses a very specific coating to ensure the device’s functionality. The sensor is connected by wire bonding to the rigid PCB. The assembly, including a rigid and a flex PCB to rigidify the structure, is a very particular process designed by NEXT Biometrics.

This report includes comparisons with the latest Huawei, Samsung, and Apple fingerprint buttons.

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Glossary

Overview / Introduction

Company Profile

Physical Analysis

  • Synthesis of the physical analysis
  • The Oyster fingerprint sensor disassembly
    • Fingerprint sensor removal
    • Fingerprint sensor assembly view
  • Dell Latitude fingerprint sensor disassembly
    • Fingerprint sensor removal
    • Fingerprint sensor assembly view
    • Fingerprint sensor cross-section
  • Sensor die
    • Sensor die view and dimensions
    • Sensor die capacitors
    • Sensor die edge contacts
    • Sensor delayering and main blocs
    • Sensor die process
    • Sensor die cross-section
  • IC control unit
    • Sensor die view and dimensions
    • Sensor delayering and main blocs
    • Sensor die process
    • Sensor die cross-section

Sensor Manufacturing Process

  • Sensor die front-end process and fabrication unit
  • ASIC die front-end process and fabrication unit
  • Final test and packaging fabrication unit
  • Synthesis of the main parts

Cost Analysis

  • Synthesis of the cost analysis
  • Main steps of the economic analysis
  • Yields explanation and hypotheses
  • Sensor die
    • Sensor die front-end cost
    • Sensor die probe test, thinning, and dicing
    • Sensor die wafer cost
    • Sensor die cost
  • ASIC component
    • ASIC die wafer cost
    • ASIC die cost
    • ASIC component packaging cost
  • Complete module fingerprint
    • Assembled components cost
    • Synthesis of the assembly
    • Fingerprint component cost
    • Fingerprint component price

Fingerprint Sensor Comparison

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