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CIRCUIT INTEGRE & RF IC

SP1946-ECU Board with the EyeQ4-Mid circuit

Mobileye EyeQ4 Vision Processor Family

Publié
24/04/2019
Code produit
SP19462
Prix
EUR 3 990
Applications
Automobile
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Fourth generation Mobileye vision processor for Advanced Driver Assistance Systems: EyeQ4-High version for Tri-cam and EyeQ4-Mid version for Mono-cam.

After releasing the EyeQ2® processor in 2010 and the EyeQ3® in 2014, the two vision processors have been at the core of the Autonomous Emergency Braking (AEB) revolution that has already saved hundreds of lives. In 2018 Mobileye, the market leader, launched the EyeQ4® processor, which offers ten times the processing capability of the EyeQ3®. EyeQ4® adds supports for mapping using Road Experience Management, Driving Policy, vehicle detection from any angle and next-generation lane detection. The vision processor market is predicted to have an impressive Compound Annual Growth Rate (CAGR) of 90% from 2018 to 2024 according to Yole Développement. Mobileye is currently the leader of camera-based ADAS, with products currently available in 160 car models including General Motors, Nissan, BMW and Honda.

 SP1946-ECU Board with the EyeQ4-Mid circuit

The EyeQ4® chipsets are developed by Mobileye and manufactured by STMicroelectronics using the proprietary 28nm Fully Depleted Silicon On Insulator (FD-SOI) low power consumption technology. Thanks to the SOI substrate, the EyeQ4® is 10 times as powerful as the EyeQ3® for just 20% more power consumption.

The EyeQ4®-High and -Mid processors, found in the ZF S-Cam4 Tri-cam and Mono-cam cameras, integrates multi-threaded Microprocessor from MIPS. These cores are coupled with the new generation of Mobileye’s Vector Micro-code Processors (VMP), Multithreaded Processing Cluster (MPC) cores and Programmable Macro Array (PMA) cores to manage up to three cameras at the same time.

This report contains a complete teardown analysis and a cost estimation of the EyeQ4®-High and-Mid processors. In a first part, information about the package and the overall die data: dimensions, main characteristics, markings ; are present. Then high-definition optical and SEM pictures of selected areas show the main Intellectual Property (IP) blocks ans the transistors’ design. Finally, cross-sections of integrated circuits (ICs) allow to understand the manufacturing process.

The report features an exhaustive comparison between the EyeQ4®-High and -Mid versions and the previous EyeQ3®, highlighting the improvements, similarities and differences between these three circuits.

SP1946-EyeQ4-Mid dieSP1946-Package Cross-SectionSP1946-Package
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Overview/Introduction

MobilEye Company Profile

EyeQ Family

Physical Analysis

  • Physical Analysis Methodology
  • System Teardown
  • EyeQ4 High and Mid Packages
    • Package views, dimensions and markings
    • Package opening
    • Package cross-section
  • EyeQ4 High and Mid Dies
    • View, dimensions and marking
    • Cross-section
    • Process characteristics

Physical Comparison 

  • Comparison between MobilEye EyeQ4-High, EyeQ4-Mid and EyeQ3

Manufacturing Process Flow

  • Global Overview
  • EyeQ4 High and Mid Front-End Process
  • EyeQ4 High and Mid Wafer Fabrication Unit
  • EyeQ4 High and Mid Package Assembly Unit
  • EyeQ4 High and Mid Back-End: Final test

Cost Analysis

  • Summary of the Cost Analysis
  • Yield Explanations and Hypotheses
  • EyeQ4 High and Mid Dies
    • Front-end cost
    • Wafer and die cost
  • EyeQ4 High & Mid Components
    • Back-end : Packaging cost
    • Back-end : Final test cost
    • Component cost

Estimated Price Analysis

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