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MEMS IMU/Combo

InvenSense MPU-9250 9-Axis IMU

Publié
13/03/2014
Code produit
SP14163
Prix
2 990 EUR
Applications
Grand public
Extrait disponible Brochure disponible Demande d'info

For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation).

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB.

 

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Glossary

Overview/Introduction , Companies Profile

 Physical Analysis

  • Package
  • Package Views & Dimensions
  • Package Opening
  • Wire bonding Process
  • Package Cross-Section

MPU-6500 Die

  • View, Dimensions & Marking
  • MEMS Removed
  • MEMS Sensing Area
  • MEMS Cap
  • ASIC Delayering & Process
  • Die Cross-Section: ASIC
  • Die Cross-Section: MEMS
  • Die Cross-Section: Sensor
  • Die Cross-Section: Cap

AK8963 Die

  • View, Dimensions & Marking
  • Hall Sensors
  • Delayering & Process
  • Die Cross-Section
  • Magnetic Concentrator Cross-Section

 Comparison with previous generation

Manufacturing Process Flow

  • MPU-6500 ASIC Front-End Process
  • MPU-6500 MEMS Process Flow
  • AK8963 ASIC Front-End Process
  • AK8963 Magnetic Concentrator Process Flow
  • Wafer Fabrication Units
  • Packaging Process Flow & Assembly Unit

 Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • MPU-6500 ASIC Front-End Cost
  • MPU-6500 MEMS Front-End Cost
  • MPU-6500 MEMS Front-End Cost per process steps
  • MPU-6500 Total Front-end Cost
  • MPU-6500 Back-End 0 : Probe Test & Dicing
  • MPU-6500 Wafer & Die Cost
  • AK8963 ASIC Front-End Cost
  • AK8963 Magnetic Concentrator Cost
  • AK8963 Total Front-end Cost
  • AK8963 Back-End 0 : Probe Test & Dicing
  • AK8963 Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test & Calibration Cost
  • MPU-9250 Component Cost

 Estimated Price Analysis

 

 

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