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MEMS IMU/Combo

InvenSense MP67B

Publié
05/02/2015
Code produit
SP16204
Prix
2 990 EUR
Applications
Grand public
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With 74.5 million units of iPhone sold during the last quarter 2014, InvenSense made a very good deal by replacing STMicroelectronics as the supplier of the gyroscope for the iPhone 6 and 6 Plus.

The MP67B is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis accelerometer) made for Apple. Compared to InvenSense’s standard 6-Axis device MPU-6500, specific modifications have been realized. The main ones consist in the package modification with the use of a LGA substrate compared to a QFN leadframe, and in the ASIC which has been redesigned.

The MP67B uses the same process as InvenSense’s second generation 6-axis device with a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefit of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

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Glossary

Overview/Introduction , InvenSense Company Profile

Physical Analysis

  • Package
    • Package Views & Dimensions
    • Package Opening
    • Wire bonding Proces
    • Package Cross-Section
  • Die
    • View, Dimensions & Marking
    • MEMS Removed
    • MEMS Sensing Area
    • MEMS Cap
    • ASIC Delayering & Process
    • Die Cross-Section: ASIC
    • Die Cross-Section: Sensor
    • Die Cross-Section: Sealing
    • Die Cross-Section: Cap

Comparison with InvenSense MPU-6500

Manufacturing Process Flow

  • ASIC Front-End Process
  • MEMS Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

Cost Analysis

  • Yields Hypotheses
  • ASIC Front-End Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per process steps
  • Total Front-end Cost
  • Back-End : Probe Test & Dicing
  • Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test & Calibration Cost
  • Component Cost

Estimated Price Analysis

  • InvenSense Financial Ratios
  • Component Price

 

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