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MEMS Gyroscope

InvenSense ITG-3200 – 3-Axis Gyroscope

Publié
10/05/2010
Code produit
SP10028
Prix
1 990 EUR
Applications
Grand public
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System Plus Consulting is proud to publish the reverse costing report of the 3-Axis MEMS Gyroscope ITG-3200 supplied by InvenSense.

The ITG-3200 is the first 3-axis (Pitch-Roll-Yaw) gyro developed by InvenSense. It uses a very thin 4x4x0.9mm QFN package. The components are manufactured on 200mm wafers using a three-bonded-wafer process: a thin sensor wafer and a protective cap wafer both processed by Deep RIE, and an ASIC wafer for signal conditioning.

The ITG-3200 3-Axis gyroscopes are suitable for various motion processing solutions for consumer products.

This report provides complete teardown of the MEMS Gyroscope with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

 

 

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Glossary

 Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

 InvenSense Company Profile

  • Product Range
  • Business Model

 Physical analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package Characteristics & Markings
  • Package Opening & Bonding Number
  • Device Structure
  • Device Dimensions
  • MEMS Sensor – Optical View
  • MEMS Sensor – Gyro Principle
  • MEMS Sensor – SEM Views
  • ASIC – Overview
  • ASIC – Markings & Bond Pads
  • ASIC – Cavities
  • ASIC – Delayering
  • ASIC – Logic Area & Memory
  • Component Cross-Sections
  • ASIC Process Characteristics
  • MEMS process characteristics

 Manufacturing Process Flow

  • Overview
  • ASIC Process Flow (CMOS + Cavity Etch)
  • MEMS Process Flow (Cap + Sensor + Assembly)
  • Description of the Wafer Fabrication Unit

Cost Analysis

  • Synthesis of the Cost Analysis
  • Main Steps of Economic Analysis
  • Yields Explanation
  • Die per wafer & Probe Test
  • Front-End Cost – Hypotheses
  • ASIC Front-End Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per Process Steps
  • MEMS Front-End : Equipment Cost per Family
  • MEMS Front-End : Material Cost per Family
  • Total Front-End Cost (ASIC + MEMS + Assembly)
  • Back-End 0 : Probe Test and Dicing
  • Total Wafer Cost (Front-End + Back-End 0)
  • Die cost
  • Back-End 1 : Packaging Cost
  • Back-End 1 : Final Test Cost
  • ITG-3200 Component Cost (FE + BE 0 + BE 1)

 Estimated Manufacturer Price Analysis

 Conclusion

 

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