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MEMS Capteur de pression

Infineon SP37 – Tire Pressure Monitoring Sensor

Publié
06/02/2014
Code produit
SP14154
Prix
2 990 EUR
Applications
Automobile
Extrait disponible Brochure disponible Demande d'info

The latest generation of Infineon‘s TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions allows to build a complete system with few external components and thus enable system cost savings.

The SP37 inherits its MEMS technology from the acquisition of the Norwegian Sensonor in 2003. Therefore, highly reliable measurements in harsh environments are possible by the use of the mature and low-cost triple stack hermetic wafer bonding technology in combination with buried piezoresistors and conductors.

The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.

This report will provide a complete teardown of the TPMS with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

 

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Glossary

Overview/Introduction

 Infineon Company Profile

 Physical Analysis

  • Physical Analysis Methodology
  • Package
  • Package Views, Dimensions & Marking
  • Package X-Ray
  • Package Opening
  • Package Cross-Section
  • ASIC Die
  • View, Dimensions & Marking
  • Delayering
  • Main Blocks
  • Cross-Section
  • Process Characteristics
  • MEMS Die
  • View, Dimensions & Marking
  • Bond Pad Opening & Bond Pad
  • Cap Removed
  • Sensing Area
  • Cross-Section:
  • Accelerometer Cross-Section
  • Pressure Sensor Cross-Section

Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow & Assembly Unit

 Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • Component Cost

 Estimated Price Analysis

  • Infineon Financial Ratios
  • SP37 Estimated Price

 

 

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