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Infineon RRN7745P & RTN7735P eWLB Fan-Out Package – 77GHz Radar Dies

Publié
22/10/2015
Code produit
SP15235
Prix
2 990 EUR
Applications
Automobile
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The new MRR1Plus 77GHz automotive radar from Bosch integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology from Infineon and an effective eWLB / Fan-Out package.

The two RF dies are packaged in the last version of the eWLB, the Fan-Out Wafer level Package developed and manufactured by Infineon. This package has no wire bonding to reduce the inductance and a specific design to increase the heat management using solder balls close to the power RF transistors.

The eWLB package is robust enough to be installed in front automotive module only protected by a plastic lid without underfill. Only a specific pad structure in gold is added on the die.

The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.

The report includes a complete physical analysis of the packaging process, with details on all technical choices regarding process, equipment and materials. The SiGe HBT are equally analyzed.

The report also features a short comparison with the first eWLB process in order to understand the evolution of technology choices.

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Overview / Introduction

Company Profile

Physical Analysis

  • Bosch MRR1Plus Radar
  • Fan-Out Wafer Level Package
    • RRN7745P Package
    • RTN7735P Package
    • Die Bond
    • eWLB Cross-Section
    • Redistribution Layer
    • Comparison eWLB
  • RRN7745P Die
    • View, Dimensions & Marking
    • Area Overview
    • Contact
    • Details
  • RTN7735P Die
  • Die Cross-Section
    • Bipolar Cross-Section
    • SiGe:C HBT Cross-Section
    • Metal layer Cross-Section

Manufacturing Process Flow

  • Global Overview
  • SiGe die Process Flows
  • SiGe die Wafer Fabrication Unit
  • eWLB Process Flows
  • eWLB Wafer Fabrication Unit

Cost Analysis

  • Main steps of economic analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • SiGe Wafer Front-End Cost
  • SiGe die Front-End Cost
  • eWLB Wafer Front-End Cost
  • Component Cost

Price estimation

  • Manufacturer Financial Ratios
  • RRN7745P Estimated Selling Price
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